N E W P R O D U C T B R I E F
1000V Q3-Class HiPerFET™ Power MOSFET In SMPD Technology
MORE POWER, LESS PACKAGE (ultra-low profile, energy efficient, and rugged)
August 2012
OVERVIEW
The 1000V/30A Q3-Class HiPerFETTM Power MOSFET is now available in the IXYS
Surface Mount Power Device (SMPD) package. The device can be easily surface-
mounted on a Printed Circuit Board (PCB), using a standard pick-and-place and reflow
soldering process. No costly screws, cables, bus-bars or hand soldered contacts are
needed. Weighing only 8g, it is much lighter (typically by 50%) than comparable
convenꢀonal power modules, enabling a lower carbon footprint for end users. This is
one of the key “green” iniꢀaꢀves of IXYS Corporaꢀon as it develops new products
lighter in weight for the Cleantech industry.
Due to its new compact and high performance SMPD package, the MMIX1F44N100Q3
MOSFET exhibits a low package inductance and high current handling capability. A
ceramic isolaꢀon of 2500V is achieved with the Direct Copper Bond (DCB) substrate
technology–an electrically isolated tab is provided for heat sinking.
The Q3-Class is a direct result of combining the latest PolarHVTM technology plaꢁorm
with advanced double metal construcꢀon, resulꢀng in an opꢀmal combinaꢀon of low
on-state resistance (RDS(on)) and gate charge (Qg). Addiꢀonally the device has a low
gate-to-drain (Miller) charge (Qgd) and low intrinsic gate resistance (RGi). These
enhancements lower gate drive requirements and switching losses.
What’s more, the power switching capability and ruggedness of the device are further
enhanced by the proven HiPerFETTM process, yielding a power MOSFET with a fast
intrinsic recꢀfier; the result is a low reverse recovery charge (Qrr), an ability to sustain
hard-switching operaꢀons, and an excellent commutaꢀng dv/dt raꢀng (up to 50V/ns).
These featured diode properꢀes translate into a faster transient response, an increase
in power efficiency, and higher operaꢀng frequencies. Other beneficial product
features include a low juncꢀon-to-case thermal resistance (RthJC(max)) of 0.18 °C/W and
high avalanche energy (EAS) raꢀng of 4 Joules.
The new Power MOSFET is well suited for such applicaꢀons as, among others, DC-DC
converters, baꢂery chargers, switch-mode and resonant power supplies, DC choppers,
temperature and lighꢀng controls, and high frequency plasma generators. In parꢀcu-
lar, the enhanced dv/dt raꢀng and high avalanche energy capability mean addiꢀonal
safety margins for stresses encountered in high voltage industrial switching applica-
ꢀons, improving the long-term reliability of these systems.
FEATURES
SMPD ADVANTAGES
APPLICATIONS
DC-DC converters
Baꢂery chargers
Switching and resonant power Supplies
DC choppers
Low RDS(on) and gate charge (Qg)
Low intrinsic gate resistance
Fast intrinsic recꢀfier
Ultra-low and compact package profile
(5.3mm height x 24.8mm length x 32.3mm width)
Surface mountable via standard reflow process
Low package weight (8g)
Excellent dv/dt performance
High power density
High avalanche energy raꢀng
2500V ceramic isolaꢀon (DCB)
Low package inductance
Temperature and lighꢀng controls
Excellent thermal performance
High power cycling capability
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