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MMIX1F44N100Q3 PDF预览

MMIX1F44N100Q3

更新时间: 2024-11-24 11:58:35
品牌 Logo 应用领域
IXYS 光电二极管
页数 文件大小 规格书
2页 2833K
描述
1000V Q3-Class HiPerFET™ Power MOSFET In SMPD Technology

MMIX1F44N100Q3 数据手册

 浏览型号MMIX1F44N100Q3的Datasheet PDF文件第2页 
POWER  
N E W P R O D U C T B R I E F  
1000V Q3-Class HiPerFET™ Power MOSFET In SMPD Technology  
MORE POWER, LESS PACKAGE (ultra-low profile, energy efficient, and rugged)  
August 2012  
OVERVIEW  
The 1000V/30A Q3-Class HiPerFETTM Power MOSFET is now available in the IXYS  
Surface Mount Power Device (SMPD) package. The device can be easily surface-  
mounted on a Printed Circuit Board (PCB), using a standard pick-and-place and reflow  
soldering process. No costly screws, cables, bus-bars or hand soldered contacts are  
needed. Weighing only 8g, it is much lighter (typically by 50%) than comparable  
convenꢀonal power modules, enabling a lower carbon footprint for end users. This is  
one of the key “green” iniꢀaꢀves of IXYS Corporaꢀon as it develops new products  
lighter in weight for the Cleantech industry.  
Due to its new compact and high performance SMPD package, the MMIX1F44N100Q3  
MOSFET exhibits a low package inductance and high current handling capability. A  
ceramic isolaꢀon of 2500V is achieved with the Direct Copper Bond (DCB) substrate  
technology–an electrically isolated tab is provided for heat sinking.  
The Q3-Class is a direct result of combining the latest PolarHVTM technology plaꢁorm  
with advanced double metal construcꢀon, resulꢀng in an opꢀmal combinaꢀon of low  
on-state resistance (RDS(on)) and gate charge (Qg). Addiꢀonally the device has a low  
gate-to-drain (Miller) charge (Qgd) and low intrinsic gate resistance (RGi). These  
enhancements lower gate drive requirements and switching losses.  
What’s more, the power switching capability and ruggedness of the device are further  
enhanced by the proven HiPerFETTM process, yielding a power MOSFET with a fast  
intrinsic recꢀfier; the result is a low reverse recovery charge (Qrr), an ability to sustain  
hard-switching operaꢀons, and an excellent commutaꢀng dv/dt raꢀng (up to 50V/ns).  
These featured diode properꢀes translate into a faster transient response, an increase  
in power efficiency, and higher operaꢀng frequencies. Other beneficial product  
features include a low juncꢀon-to-case thermal resistance (RthJC(max)) of 0.18 °C/W and  
high avalanche energy (EAS) raꢀng of 4 Joules.  
The new Power MOSFET is well suited for such applicaꢀons as, among others, DC-DC  
converters, baꢂery chargers, switch-mode and resonant power supplies, DC choppers,  
temperature and lighꢀng controls, and high frequency plasma generators. In parꢀcu-  
lar, the enhanced dv/dt raꢀng and high avalanche energy capability mean addiꢀonal  
safety margins for stresses encountered in high voltage industrial switching applica-  
ꢀons, improving the long-term reliability of these systems.  
FEATURES  
SMPD ADVANTAGES  
APPLICATIONS  
DC-DC converters  
Baꢂery chargers  
Switching and resonant power Supplies  
DC choppers  
Low RDS(on) and gate charge (Qg)  
Low intrinsic gate resistance  
Fast intrinsic recꢀfier  
Ultra-low and compact package profile  
(5.3mm height x 24.8mm length x 32.3mm width)  
Surface mountable via standard reflow process  
Low package weight (8g)  
Excellent dv/dt performance  
High power density  
High avalanche energy raꢀng  
2500V ceramic isolaꢀon (DCB)  
Low package inductance  
Temperature and lighꢀng controls  
Excellent thermal performance  
High power cycling capability  
www.ixys.com  

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