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BCM384P120M1K5AC1 PDF预览

BCM384P120M1K5AC1

更新时间: 2024-12-04 01:11:51
品牌 Logo 应用领域
VICOR /
页数 文件大小 规格书
23页 2974K
描述
Up to 1500 W continuous output power

BCM384P120M1K5AC1 数据手册

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BCM® Bus Converter  
BCM384y120x1K5AC1  
S
®
C
NRTL US  
C
US  
Fixed Ratio DC-DC Converter  
Features  
Product Ratings  
Up to 1500 W continuous output power  
2208 W/in3 power density  
VIN = 384 V (260 – 410 V)  
POUT = up to 1500 W  
K = 1/32  
97.4% peak efficiency  
VOUT = 12 V (8.1 – 12.8 V)  
4242 Vdc isolation  
(NO LOAD)  
Parallel operation for multi-kW arrays  
OV, OC, UV, short circuit and thermal protection  
2361 through-hole ChiP package  
n2.402” x 0.990” x 0.286”  
Product Description  
The VI Chip® Bus Converter (BCM) is a high efficiency Sine  
Amplitude Converter (SAC), operating from a 260 to 410 VDC  
primary bus to deliver an isolated ratiometric output from  
8.1 to 12.8 VDC.  
(61.00 mm x 25.14 mm x 7.26 mm)  
PMBusTM management interface*  
The BCM384y120x1K5AC1 offers low noise, fast transient  
response, and industry leading efficiency and power density. In  
addition, it provides an AC impedance beyond the bandwidth  
of most downstream regulators, allowing input capacitance  
normally located at the input of a POL regulator to be located at  
the input of the BCM module. With a K factor of 1/32, that  
capacitance value can be reduced by a factor of 1024x, resulting  
in savings of board area, material and total system cost.  
Typical Applications  
380 DC Power Distribution  
High End Computing Systems  
Automated Test Equipment  
Industrial Systems  
The BCM384y120x1K5AC1, combined with the D44TL1A0  
Digital Supervisor and I13TL1A0 Digital Isolator, provide a  
secondary referenced PMBus™ compatible telemetry and  
control interface. This interface provides access to the BCM’s  
internal controller configuration, fault monitoring, and other  
telemetry functions.  
High Density Power Supplies  
Communications Systems  
Transportation  
Leveraging the thermal and density benefits of Vicor’s ChiP  
packaging technology, the BCM module offers flexible thermal  
management options with very low top and bottom side  
thermal impedances. Thermally-adept ChiP-based power  
components, enable customers to achieve low cost power  
system solutions with previously unattainable system size,  
weight and efficiency attributes, quickly and predictably.  
*When used with D44TL1A0 and I13TL1A0 chipset  
BCM® Bus Converter  
Page 1 of 23  
Rev 1.4  
05/2015  
vicorpower.com  
800 927.9474  

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