New Product
SiA437DJ
Vishay Siliconix
www.vishay.com
P-Channel 20 V (D-S) MOSFET
FEATURES
PRODUCT SUMMARY
• TrenchFET® Power MOSFET
VDS (V)
RDS(on) () (Max.)
ID (A)a
- 29.7
- 25
Qg (Typ.)
• Thermally Enhanced PowerPAK® SC-70 Package
- Small Footprint Area
- Low On-Resistance
• 100 % Rg Tested
• Material categorization: For definitions of compliance
please see www.vishay.com/doc?99912
0.0145 at VGS = - 4.5 V
0.0205 at VGS = - 2.5 V
0.0330 at VGS = - 1.8 V
0.0650 at VGS = - 1.5 V
- 20
28 nC
- 19.7
- 4
APPLICATIONS
• Providing low voltage drop in Smart Phones, Tablet PCs,
Mobile Computing:
PowerPAK SC-70-6L-Single
1
- Battery Switches
- Load Switches
- Power Management
S
D
2
D
3
G
D
6
S
D
Marking Code
5
2.05 mm
S
2.05 mm
G
4
B U X
Part # code
X X X
Ordering Information:
Lot Traceability
and Date code
SiA437DJ-T1-GE3 (Lead (Pb)-free and Halogen-free)
D
P-Channel MOSFET
ABSOLUTE MAXIMUM RATINGS (TC = 25 °C, unless otherwise noted)
Parameter
Symbol
Limit
- 20
Unit
Drain-Source Voltage
Gate-Source Voltage
VDS
V
VGS
8
T
T
C = 25 °C
C = 70 °C
- 29.7
- 23.8
- 12.6b, c
- 10b, c
- 60
Continuous Drain Current (TJ = 150 °C)
ID
TA = 25 °C
TA = 70 °C
A
Pulsed Drain Current (t = 300 μs)
IDM
IS
T
C = 25 °C
- 16
- 2.9b, c
Continuous Source-Drain Diode Current
TA = 25 °C
T
T
C = 25 °C
C = 70 °C
19
12
Maximum Power Dissipation
PD
W
TA = 25 °C
TA = 70 °C
3.5b, c
2.2b, c
- 50 to 150
260
Operating Junction and Storage Temperature Range
Soldering Recommendations (Peak Temperature)d, e
TJ, Tstg
°C
THERMAL RESISTANCE RATINGS
Parameter
Maximum Junction-to-Ambientb, f
Symbol
RthJA
Typical
Maximum
Unit
t 5 s
28
36
°C/W
Maximum Junction-to-Case (Drain)
Steady State
RthJC
5.3
6.5
Notes
a. TC = 25 °C.
b. Surface mounted on 1" x 1" FR4 board.
c. t = 5 s.
d. See solder profile (www.vishay.com/doc?73257). The PowerPAK SC-70 is a leadless package. The end of the lead terminal is exposed
copper (not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed
and is not required to ensure adequate bottom side solder interconnection.
e. Rework conditions: manual soldering with a soldering iron is not recommended for leadless components.
f. Maximum under steady state conditions is 80 °C/W.
S12-2728-Rev. A, 12-Nov-12
Document Number: 62777
1
For technical questions, contact: pmostechsupport@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000