Datasheet > SIA449DJ

SIA449DJ

更新时间： 2024-09-16 12:04:23

品牌	Logo	应用领域
威世 - VISHAY		/
页数	文件大小	规格书
9页	210K
描述
P-Channel 30 V (D-S) MOSFET

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SIA449DJ 数据手册

SiA449DJ

Vishay Siliconix

P-Channel 30 V (D-S) MOSFET

FEATURES

PRODUCT SUMMARY

•

TrenchFET^®Power MOSFET

Thermally Enhanced PowerPAK^®SC-70 Package

- Small Footprint Area

V_DS(V)

R_DS(on)() (Max.)

0.020 at V_GS= - 10 V

0.024 at V_GS= - 4.5 V

0.038 at V_GS= - 2.5 V

I_D(A)

- 12^a

Q_g(Typ.)

- Low On-Resistance

100 % R_gTested

Material categorization:

- 30

23.1 nC

•

For definitions of compliance please see

www.vishay.com/doc?99912

PowerPAK SC-70-6L-Single

APPLICATIONS

• Providing low voltage drop in

Smart Phones, Tablet PCs,

Mobile Computing:

- Power Management

- Charger Switches

- Load Switches

- DC/DC Converters

2.05 mm

Marking Code

BWX

Ordering Information:

SiA449DJ-T1-GE3 (Lead (Pb)-free and Halogen-free)

Part # code

X X X

Lot Traceability

and Date code

P-Channel MOSFET

ABSOLUTE MAXIMUM RATINGS (T = 25 °C, unless otherwise noted)

Parameter

Symbol

Limit

- 30

Unit

V_DS

Drain-Source Voltage

Gate-Source Voltage

V_GS

- 12^a

- 10.4^{b, c}

- 8.3^{b, c}

- 30

T_C= 25 °C

_C= 70 °C

Continuous Drain Current (T_J= 150 °C)

I_D

T_A= 25 °C

T_A= 70 °C

I_DM

I_S

Pulsed Drain Current (t = 300 µs)

- 12^a

- 2.9^{b, c}

T_C= 25 °C

Continuous Source-Drain Diode Current

T_A= 25 °C

_C= 25 °C

_C= 70 °C

_A= 25 °C

Maximum Power Dissipation

P_D

3.5^{b, c}

2.2^{b, c}

- 55 to 150

260

T_A= 70 °C

T_J, T_stg

Operating Junction and Storage Temperature Range

Soldering Recommendations (Peak Temperature)^{d, e}

°C

THERMAL RESISTANCE RATINGS

Parameter

Maximum Junction-to-Ambient^{b, f}

Symbol

R_thJA

Typical

Maximum

Unit

t  5 s

°C/W

R_thJC

Maximum Junction-to-Case (Drain)

Steady State

5.3

6.5

Notes:

a. Package limited

b. Surface mounted on 1" x 1" FR4 board.

c. t = 5 s.

d. See solder profile (www.vishay.com/doc?73257). The PowerPAK SC-70 is a leadless package. The end of the lead terminal is exposed

copper (not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed and

is not required to ensure adequate bottom side solder interconnection.

e. Rework conditions: manual soldering with a soldering iron is not recommended for leadless components.

f. Maximum under steady state conditions is 80 °C/W.

Document Number: 62644

S13-1993-Rev. B, 23-Sep-13

For technical questions, contact: pmostechsupport@vishay.com

This document is subject to change without notice.

www.vishay.com

THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000

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