SiA459EDJ
Vishay Siliconix
www.vishay.com
P-Channel 20 V (D-S) MOSFET
FEATURES
PRODUCT SUMMARY
• TrenchFET® Power MOSFET
VDS (V)
RDS(on) () (Max.)
0.0350 at VGS = - 4.5 V
0.0395 at VGS = - 3.7 V
0.0620 at VGS = - 2.5 V
ID (A)a
- 9
Qg (Typ.)
• Thermally Enhanced PowerPAK® SC-70 Package
- Small Footprint Area
- Low On-Resistance
• 100 % Rg Tested
- 20
- 9
10 nC
- 9
• Typical ESD Protection: 2000 V (HBM)
• Material categorization: For definitions of compliance
please see www.vishay.com/doc?99912
PowerPAK SC-70-6L-Single
1
S
APPLICATIONS
D
2
• Portable Devices such as Smart Phones,
Tablet PCs and Mobile Computing
D
3
G
- DC/DC Converter
D
6
- Battery Switch
- Load Switch
S
G
D
5
2.05 mm
S
2.05 mm
- Power Management
4
Marking Code
D
B 3 X
Ordering Information:
SiA459EDJ-T1-GE3 (Lead (Pb)-free and Halogen-free)
Part # code
P-Channel MOSFET
X X X
Lot Traceability
and Date code
ABSOLUTE MAXIMUM RATINGS (TC = 25 °C, unless otherwise noted)
Parameter
Symbol
Limit
- 20
Unit
Drain-Source Voltage
Gate-Source Voltage
VDS
V
VGS
12
- 9a
T
C = 25 °C
- 9a
TC = 70 °C
TA = 25 °C
TA = 70 °C
Continuous Drain Current (TJ = 150 °C)
ID
- 7.4b, c
- 6b, c
- 40
- 9a
- 2.4b, c
A
Pulsed Drain Current (t = 100 μs)
IDM
IS
TC = 25 °C
TA = 25 °C
Continuous Source-Drain Diode Current
T
C = 25 °C
15.6
TC = 70 °C
TA = 25 °C
TA = 70 °C
10
Maximum Power Dissipation
PD
W
2.9b, c
1.8b, c
- 50 to 150
260
Operating Junction and Storage Temperature Range
Soldering Recommendations (Peak Temperature)d, e
TJ, Tstg
°C
THERMAL RESISTANCE RATINGS
Parameter
Maximum Junction-to-Ambientb, f
Symbol
RthJA
Typical
Maximum
Unit
t 5 s
32
6
43
8
°C/W
Maximum Junction-to-Case (Drain)
Steady State
RthJC
Notes
a. Package limited.
b. Surface mounted on 1" x 1" FR4 board.
c. t = 5 s.
d. See solder profile (www.vishay.com/doc?73257). The PowerPAK SC-70 is a leadless package. The end of the lead terminal is exposed
copper (not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed
and is not required to ensure adequate bottom side solder interconnection.
e. Rework conditions: manual soldering with a soldering iron is not recommended for leadless components.
f. Maximum under steady state conditions is 80 °C/W.
S13-2182-Rev. A, 14-Oct-13
Document Number: 62912
1
For technical questions, contact: pmostechsupport@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000