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SiA469DJ PDF预览

SiA469DJ

更新时间: 2024-11-07 14:53:47
品牌 Logo 应用领域
威世 - VISHAY /
页数 文件大小 规格书
9页 275K
描述
P-Channel 30 V (D-S) MOSFET

SiA469DJ 数据手册

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SiA469DJ  
Vishay Siliconix  
www.vishay.com  
P-Channel 30 V (D-S) MOSFET  
FEATURES  
PowerPAK® SC-70-6L Single  
• TrenchFET® Gen III p-channel power MOSFET  
• Thermally enhanced PowerPAK® SC-70 package  
• 100% Rg tested  
D
D
5
6
S
4
• Material categorization:  
for definitions of compliance please see  
www.vishay.com/doc?99912  
S
7
1
D
2
D
APPLICATIONS  
• Load switch  
3
G
S
1
Top View  
Bottom View  
• DC/DC converters  
PRODUCT SUMMARY  
VDS (V)  
• High speed switching  
G
-30  
0.0265  
0.0400  
10  
-12  
Single  
• Power management  
battery-operated, mobile and  
wearable devices  
in  
R
R
DS(on) max. () at VGS = -10 V  
DS(on) max. () at VGS = -4.5 V  
Qg typ. (nC)  
D (A) a  
Configuration  
P-Channel MOSFET  
I
D
ORDERING INFORMATION  
Package  
Lead (Pb)-free and halogen-free  
PowerPAK SC-70  
SiA469DJ-T1-GE3  
ABSOLUTE MAXIMUM RATINGS (TA = 25 °C, unless otherwise noted)  
PARAMETER  
SYMBOL  
LIMIT  
-30  
UNIT  
Drain-source voltage  
Gate-source voltage  
VDS  
V
VGS  
20  
TC = 25 °C  
-12 a  
TC = 70 °C  
TA =25 °C  
TA = 70 °C  
-12 a  
Continuous drain current (TJ = 150 °C)  
ID  
-8.8 b, c  
-7 b, c  
-40  
-12 a  
-2.7 b, c  
A
Pulsed drain current (t = 100 μs)  
IDM  
IS  
TC = 25 °C  
Continuous source-drain diode current  
TA = 70 °C  
T
C = 25 °C  
C = 70 °C  
15.6  
T
10  
Maximum power dissipation  
PD  
W
TA = 25 °C  
TA = 70 °C  
3.3 b, c  
2.1 b, c  
-55 to +150  
260  
Operating junction and storage temperature range  
Soldering recommendations (peak temperature) d, e  
TJ, Tstg  
°C  
THERMAL RESISTANCE RATINGS  
PARAMETER  
Maximum junction-to-ambient b, f  
SYMBOL  
RthJA  
TYPICAL  
30  
MAXIMUM  
UNIT  
t 5 s  
Steady state  
38  
8
°C/W  
Maximum junction-to-case (drain)  
Notes  
RthJC  
6.5  
a. Package limited.  
b. Surface mounted on 1" x 1" FR4 board.  
c. t = 5 s.  
d. See solder profile (www.vishay.com/ppg?73257). The PowerPAK SC-70 is a leadless package. The end of the lead terminal is exposed  
copper (not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed  
and is not required to ensure adequate bottom side solder interconnection.  
e. Rework conditions: manual soldering with a soldering iron is not recommended for leadless components.  
f. Maximum under steady state conditions is 80 °C/W.  
S16-2441Rev. A, 05-Dec-16  
Document Number: 75354  
1
For technical questions, contact: pmostechsupport@vishay.com  
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT  
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000  

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