SiA483ADJ
Vishay Siliconix
www.vishay.com
P-Channel 30 V (D-S) MOSFET
FEATURES
• TrenchFET® Gen IV p-channel power MOSFET
• Thermally enhanced PowerPAK® SC-70 package
PowerPAK® SC-70-6L Single
D
D
5
6
S
4
• Provides excellent RDS-Qg Figure-of-Merit (FOM)
for switching applications
• 100 % Rg tested
S
7
• Material categorization: for definitions of
compliance please see www.vishay.com/doc?99912
1
D
2
D
3
1
G
APPLICATIONS
Top View
Bottom View
S
• Battery charging and management
• Load switch
Marking code: KA
PRODUCT SUMMARY
VDS (V)
• DC/DC converters
G
-30
0.020
0.033
8.3
• Power management in battery-operated,
mobile and wearable devices
RDS(on) max. () at VGS = -10 V
RDS(on) max. () at VGS = -4.5 V
Qg typ. (nC)
P-Channel
MOSFET
I
D (A) f
-12
D
Configuration
Single
ORDERING INFORMATION
Package
PowerPAK SC-70
Lead (Pb)-free and halogen-free
SiA483ADJ-T1-GE3
ABSOLUTE MAXIMUM RATINGS (TA = 25 °C, unless otherwise noted)
PARAMETER
SYMBOL
LIMIT
-30
-20 / +16
-12 f
UNIT
Drain-source voltage
Gate-source voltage
VDS
VGS
V
TC = 25 °C
TC = 70 °C
TA =25 °C
TA = 70 °C
-12 f
Continuous drain current (TJ = 150 °C)
ID
-10.6 a, b
-8.5 a, b
-60
A
Pulsed drain current (t = 100 μs)
IDM
IS
TC = 25 °C
TA = 25 °C
TC = 25 °C
TC = 70 °C
TA = 25 °C
TA = 70 °C
-12 f
-2.9 a, b
17.9
11.4
3.4 a, b
2.2 a, b
-55 to +150
260
Continuous source-drain diode current
Maximum power dissipation
PD
W
Operating junction and storage temperature range
Soldering recommendations (peak temperature) c, d
TJ, Tstg
°C
THERMAL RESISTANCE RATINGS
PARAMETER
Maximum junction-to-ambient a, e
SYMBOL
RthJA
TYPICAL
29
MAXIMUM
UNIT
t 5 s
Steady state
37
7
°C/W
Maximum junction-to-case (drain)
Notes
RthJC
5.5
a. Surface mounted on 1" x 1" FR4 board
b. t = 5 s
c. See solder profile (www.vishay.com/ppg?73257). The PowerPAK SC-70 is a leadless package. The end of the lead terminal is exposed
copper (not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed
and is not required to ensure adequate bottom side solder interconnection
d. Rework conditions: manual soldering with a soldering iron is not recommended for leadless components
e. Maximum under steady state conditions is 80 °C/W
f. Package limited
S19-0391-Rev. A, 29-Apr-2019
Document Number: 77080
1
For technical questions, contact: pmostechsupport@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000