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SIA906EDJ

更新时间: 2024-09-27 09:25:39
品牌 Logo 应用领域
威世 - VISHAY /
页数 文件大小 规格书
9页 230K
描述
Dual N-Channel 20-V (D-S) MOSFET

SIA906EDJ 数据手册

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New Product  
SiA906EDJ  
Vishay Siliconix  
Dual N-Channel 20-V (D-S) MOSFET  
FEATURES  
PRODUCT SUMMARY  
Halogen-free According to IEC 61249-2-21  
VDS (V)  
RDS(on) (Ω)  
Qg (Typ.)  
I
D (A)a  
4.5  
TrenchFET® Power MOSFET  
New Thermally Enhanced PowerPAK®  
SC-70 Package  
0.046 at VGS = 4.5 V  
0.063 at VGS = 2.5 V  
20  
3.5 nC  
4.5  
- Small Footprint Area  
- Low On-Resistance  
Typical ESD Protection 560 V  
APPLICATIONS  
PowerPAK SC-70-6 Dual  
Load Switch for Portable Applications  
High Frequency DC/DC Converter  
D2  
D1  
1
S1  
2
G1  
3
D1  
D2  
Marking Code  
G2  
G1  
D1  
6
D2  
G2  
C C X  
X X X  
5
Part # code  
2.05 mm  
2.05 mm  
S2  
4
Lot Traceability  
and Date code  
S2  
S1  
N-Channel MOSFET  
Ordering Information: SiA906EDJ-T1-GE3 (Lead (Pb)-free and Halogen-free)  
N-Channel MOSFET  
ABSOLUTE MAXIMUM RATINGS T = 25 °C, unless otherwise noted  
A
Parameter  
Drain-Source Voltage  
Gate-Source Voltage  
Symbol  
VDS  
VGS  
Limit  
20  
12  
4.5a  
4.5a  
4.5a, b, c  
4.1b, c  
15  
4.5a  
1.6b, c  
7.8  
Unit  
V
T
C = 25 °C  
TC = 70 °C  
TA = 25 °C  
TA = 70 °C  
Continuous Drain Current (TJ = 150 °C)  
ID  
A
IDM  
IS  
Pulsed Drain Current  
T
C = 25 °C  
Continuous Source-Drain Diode Current  
TA = 25 °C  
TC = 25 °C  
T
C = 70 °C  
5
PD  
Maximum Power Dissipation  
W
1.9b, c  
TA = 25 °C  
TA = 70 °C  
1.2b, c  
- 55 to 150  
TJ, Tstg  
Operating Junction and Storage Temperature Range  
Soldering Recommendations (Peak Temperature)d, e  
°C  
260  
THERMAL RESISTANCE RATINGS  
Parameter  
Maximum Junction-to-Ambientb, f  
Maximum Junction-to-Case (Drain)  
Symbol  
RthJA  
RthJC  
Typical  
52  
Maximum  
Unit  
t 5 s  
Steady State  
65  
16  
°C/W  
12.5  
Notes:  
a. Package limited  
b. Surface Mounted on 1" x 1" FR4 board.  
c. t = 5 s.  
d. See Solder Profile (www.vishay.com/ppg?73257). The PowerPAK SC-70 is a leadless package. The end of the lead terminal is exposed  
copper (not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed  
and is not required to ensure adequate bottom side solder interconnection.  
e. Rework Conditions: manual soldering with a soldering iron is not recommended for leadless components.  
f. Maximum under Steady State conditions is 110 °C/W.  
Document Number: 69067  
S-83087-Rev. A, 29-Dec-08  
www.vishay.com  
1

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