SiA923AEDJ
Vishay Siliconix
www.vishay.com
Dual P-Channel 20 V (D-S) MOSFET
FEATURES
PRODUCT SUMMARY
• TrenchFET® Power MOSFET
VDS (V)
RDS(on) () MAX.
0.054 at VGS = -4.5 V
0.070 at VGS = -2.5 V
0.104 at VGS = -1.8 V
0.165 at VGS = -1.5 V
ID (A)
-4.5 a
-4.5 a
-4.5 a
-1.5
Qg (TYP.)
• Thermally Enhanced PowerPAK® SC-70 Package
- Small Footprint Area
- Low On-Resistance
• Typical ESD Protection: 2500 V
• 100 % Rg Tested
-20
9.5 nC
• Material categorization: For definitions of compliance
please see www.vishay.com/doc?99912
PowerPAK® SC-70-6L Dual
D1
6
G2
5
APPLICATIONS
• Charger Switches and Load Switches for Portable Devices
S2
4
D1
• DC/DC Converters
D2
S1
S2
1
S1
2
3
D2
G1
1
G1
G2
Top View
Bottom View
Marking Code: DP
Ordering Information:
SiA923AEDJ-T1-GE3 (Lead (Pb)-free and Halogen-free)
P-Channel MOSFET
P-Channel MOSFET
D1
D2
ABSOLUTE MAXIMUM RATINGS (TA = 25 °C, unless otherwise noted)
PARAMETER
SYMBOL
LIMIT
UNIT
Drain-Source Voltage
Gate-Source Voltage
VDS
-20
V
VGS
8
T
C = 25 °C
-4.5 a
-4.5 a
-4.5 a,b,c
-4.5 a,b,c
-15
-4.5 a
-1.6 b,c
7.8
TC = 70 °C
TA = 25 °C
TA = 70 °C
Continuous Drain Current (TJ = 150 °C)
ID
A
Pulsed Drain Current (t = 100 μs)
IDM
IS
T
C = 25 °C
Continuous Source-Drain Diode Current
TA = 25 °C
T
T
C = 25 °C
C = 70 °C
5
Maximum Power Dissipation
PD
W
TA = 25 °C
TA = 70 °C
1.9 b,c
1.2 b,c
Operating Junction and Storage Temperature Range
Soldering Recommendations (Peak Temperature) d,e
TJ, Tstg
-55 to 150
260
°C
THERMAL RESISTANCE RATINGS
PARAMETER
Maximum Junction-to-Ambient b,f
SYMBOL
RthJA
TYPICAL
MAXIMUM
UNIT
t 5 s
52
65
16
°C/W
Maximum Junction-to-Case (Drain)
Steady State
RthJC
12.5
Notes
a. Package limited.
b. Surface mounted on 1" x 1" FR4 board.
c. t = 5 s.
d. See solder profile (www.vishay.com/doc?73257). The PowerPAK SC-70 is a leadless package. The end of the lead terminal is exposed
copper (not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed
and is not required to ensure adequate bottom side solder interconnection.
e. Rework conditions: Manual soldering with a soldering iron is not recommended for leadless components.
f. Maximum under steady state conditions is 110 °C/W.
S13-2636-Rev. A, 30-Dec-13
Document Number: 62936
1
For technical questions, contact: pmostechsupport@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000