SiAA00DJ
Vishay Siliconix
www.vishay.com
N-Channel 25 V (D-S) MOSFET
FEATURES
• TrenchFET® Gen IV power MOSFET
PowerPAK® SC-70-6L Single
D
D
5
• Optimized Qg, Qgd, and Qgd/Qgs ratio reduces
switching related power loss
6
S
4
• Provides exceptional versatility for power
management design
• Very low RDS(on) and excellent RDS - Qg Figure-of-Merit
(FOM) in an ultra-compact package footprint
S
7
1
D
2
D
• Optimized for high-frequency switching
• 100 % Rg and UIS tested
3
G
1
Top View
Bottom View
• Material categorization: for definitions of compliance
please see www.vishay.com/doc?99912
Marking code: A5
PRODUCT SUMMARY
VDS (V)
RDS(on) max. () at VGS = 10 V
RDS(on) max. () at VGS = 4.5 V
Qg typ. (nC)
D
S
APPLICATIONS
25
• Synchronous rectification
• High power density DC/DC
• Synchronous buck converter
• Load switching
0.0056
0.0075
7.4
40 a, g
Single
G
N-Channel MOSFET
ID (A)
Configuration
• Battery charging and management
ORDERING INFORMATION
Package
Lead (Pb)-free and halogen-free
PowerPAK SC-70
SiAA00DJ-T1-GE3
ABSOLUTE MAXIMUM RATINGS (TA = 25 °C, unless otherwise noted)
PARAMETER
SYMBOL
LIMIT
25
+16 / -12
40 a
40 a
20.1 b, c
16.1 b, c
80
16
2.9 b, c
19.2
12.3
3.5 b, c
2.2 b, c
-55 to +150
260
UNIT
Drain-source voltage
Gate-source voltage
VDS
VGS
V
TC = 25 °C
TC = 70 °C
TA = 25 °C
TA = 70 °C
Continuous drain current (TJ = 150 °C)
ID
A
Pulsed drain current (t = 100 μs)
IDM
IS
TC = 25 °C
Continuous source-drain diode current
TA = 25 °C
TC = 25 °C
TC = 70 °C
TA = 25 °C
TA = 70 °C
Maximum power dissipation
PD
W
Operating junction and storage temperature range
Soldering recommendations (peak temperature) c
TJ, Tstg
°C
THERMAL RESISTANCE RATINGS
PARAMETER
Maximum junction-to-ambient b
SYMBOL
RthJA
RthJC
TYPICAL
28
MAXIMUM
UNIT
t 10 s
Steady state
36
6.5
°C/W
Maximum junction-to-case (drain)
5.3
Notes
a. Package limited
b. Surface mounted on 1" x 1" FR4 board
c. t = 10 s
d. See solder profile (www.vishay.com/doc?73257). The PowerPAK SC-70 is a leadless package. The end of the lead terminal is exposed
copper (not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed
and is not required to ensure adequate bottom side solder interconnection
e. Rework conditions: manual soldering with a soldering iron is not recommended for leadless components
f. Maximum under steady state conditions is 80 °C/W
g. TC = 25 °C
S17-1867-Rev. A, 25-Dec-17
Document Number: 75918
1
For technical questions, contact: pmostechsupport@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000