SiAA40DJ
Vishay Siliconix
www.vishay.com
N-Channel 40 V (D-S) MOSFET
FEATURES
PowerPAK® SC-70-6L Single
• TrenchFET® Gen IV power MOSFET
D
D
5
6
• Tuned for the lowest RDS - Qoss FOM
S
4
•
Thermally enhanced PowerPAK® SC-70 package
- Small footprint area
• 100 % Rg and UIS tested
S
7
• Material categorization: for definitions of compliance
please see www.vishay.com/doc?99912
1
D
2
D
3
1
G
D
APPLICATIONS
Top View
Bottom View
• DC/DC converters
Marking code: A1
• Synchronous rectification
• Motor drive control
PRODUCT SUMMARY
VDS (V)
RDS(on) max. () at VGS = 10 V
40
• Battery management and
protection
G
0.0125
0.0160
7.7
RDS(on) max. () at VGS = 4.5 V
• Load switch
Qg typ. (nC)
ID (A)
30 a
S
N-Channel MOSFET
Configuration
Single
ORDERING INFORMATION
Package
PowerPAK SC-70
SiAA40DJ-T1-GE3
Lead (Pb)-free and halogen-free
ABSOLUTE MAXIMUM RATINGS (TA = 25 °C, unless otherwise noted)
PARAMETER
Drain-source voltage
Gate-source voltage
SYMBOL
LIMIT
40
+20 / -16
30
UNIT
VDS
VGS
V
TC = 25 °C
C = 70 °C
TA = 25 °C
TA = 70 °C
T
24
Continuous drain current (TJ = 150 °C)
ID
12.8 b, c
10.2 b, c
60
A
Pulsed drain current (t = 100 μs)
IDM
IS
TC = 25 °C
16
2.9 b, c
10
5
19.2
Continuous source-drain diode current
TA = 25 °C
L = 0.1 mH
TC = 25 °C
Single-pulse avalanche current
Single-pulse avalanche energy
IAS
EAS
mJ
W
TC = 70 °C
12.3
Maximum power dissipation
PD
TA = 25 °C
TA = 70 °C
3.5 b, c
2.2 b, c
-55 to +150
260
Operating junction and storage temperature range
Soldering recommendations (peak temperature) d, e
TJ, Tstg
°C
THERMAL RESISTANCE RATINGS
PARAMETER
SYMBOL
RthJA
RthJC
TYPICAL
28
MAXIMUM
UNIT
Maximum junction-to-ambient b, f
t 5 s
Steady state
36
6.5
°C/W
Maximum junction-to-case (drain)
5.3
Notes
a. TC = 25 °C.
b. Surface mounted on 1" x 1" FR4 board
c. t = 5 s
d. See solder profile (www.vishay.com/doc?73257). The PowerPAK SC-70 is a leadless package. The end of the lead terminal is exposed
copper (not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed
and is not required to ensure adequate bottom side solder interconnection
e. Rework conditions: Manual soldering with a soldering iron is not recommended for leadless components
f. Maximum under steady state conditions is 80 °C/W
S18-0352-Rev. C, 26-Mar-18
Document Number: 75671
1
For technical questions, contact: pmostechsupport@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000