SiA931DJ
Vishay Siliconix
www.vishay.com
Dual P-Channel 30 V (D-S) MOSFET
FEATURES
PowerPAK® SC-70-6L Dual
• TrenchFET® Gen III power MOSFET
D1
6
G2
5
• Thermally enhanced PowerPAK®
SC-70 package
S2
4
- Small footprint area
- Low on-resistance
D1
D2
• 100 % Rg tested
• Material categorization: for definitions of
compliance please see www.vishay.com/doc?99912
1
S1
2
G1
3
Top View
D2
APPLICATIONS
Bottom View
• Smart phones, tablet PCs, mobile computing:
- Battery switches
Marking code: DO
- Load switches
PRODUCT SUMMARY
VDS (V)
- Power management
- DC/DC converters
-30
0.065
0.080
0.100
4.1
S
1
S
2
RDS(on) max. () at VGS = -10 V
RDS(on) max. () at VGS = -6 V
RDS(on) max. () at VGS = -4.5 V
G
G
2
1
Qg typ. (nC)
D (A) a
Configuration
I
-4.5
P-Channel MOSFET
P-Channel MOSFET
Dual
D
1
D
2
ORDERING INFORMATION
Package
Lead (Pb)-free and halogen-free
PowerPAK SC-70
SiA931DJ-T1-GE3
ABSOLUTE MAXIMUM RATINGS (TA = 25 °C, unless otherwise noted)
PARAMETER
SYMBOL
LIMIT
-30
20
UNIT
Drain-source voltage
Gate-source voltage
VDS
VGS
V
TC = 25 °C
C = 70 °C
TA = 25 °C
TA = 70 °C
-4.5 a
-4.5 a
-4.3 b, c
-3.4 b, c
-28
-4.5 a
-1.6 b, c
7.8
T
Continuous drain current (TJ = 150 °C)
ID
A
Pulsed drain current (t = 300 μs)
IDM
IS
TC = 25 °C
Continuous source-drain diode current
TA = 25 °C
TC = 25 °C
T
C = 70 °C
5
Maximum power dissipation
PD
W
TA = 25 °C
TA = 70 °C
1.9 b, c
1.2 b, c
Operating junction and storage temperature range
Soldering recommendations (peak temperature) d, e
TJ, Tstg
-55 to +150
260
°C
THERMAL RESISTANCE RATINGS
PARAMETER
Maximum junction-to-ambient b, f
Maximum junction-to-case (drain)
SYMBOL
RthJA
RthJC
TYPICAL
MAXIMUM
UNIT
t 5 s
Steady state
52
12.5
65
16
°C/W
Notes
a. Package limited
b. Surface mounted on 1" x 1" FR4 board
c. t = 5 s
d. See solder profile (www.vishay.com/doc?73257). The PowerPAK SC-70 is a leadless package. The end of the lead terminal is exposed
copper (not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed
and is not required to ensure adequate bottom side solder interconnection
e. Rework conditions: manual soldering with a soldering iron is not recommended for leadless components
f. Maximum under steady state conditions is 110 °C/W
S13-1163-Rev. A, 13-May-13
Document Number: 62859
1
For technical questions, contact: pmostechsupport@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000