SiA938DJT
Vishay Siliconix
www.vishay.com
Dual N-Channel 20 V (D-S) MOSFET
FEATURES
• TrenchFET® Gen IV power MOSFET
PowerPAK® SC-70-6L Dual
D1
6
G2
5
S2
• Very low RDS(on) and excellent RDS x Qg
Figure-of-Merit (FOM) in an ultra compact
package footprint
4
D1
D2
• Compact and thermally enhanced package
• Provides exceptional versatility for power management
design
1
S1
2
3
D2
G1
• Material categorization: for definitions of compliance
please see www.vishay.com/doc?99912
Top View
Bottom View
Marking code: A7
APPLICATIONS
D1
D2
• Synchronous rectification
• Half-bridge power stage
• DC/DC converters
• Battery management
• Load switch
PRODUCT SUMMARY
VDS (V)
20
0.0215
0.0245
0.048
3.5
RDS(on) max. (Ω) at VGS = 10 V
RDS(on) max. (Ω) at VGS = 4.5 V
RDS(on) max. (Ω) at VGS = 2.5 V
Qg typ. (nC)
G2
G1
S1
N-Channel MOSFET
S2
N-Channel MOSFET
ID (A) a
4.5
Configuration
Dual
ORDERING INFORMATION
Package
PowerPAK SC-70
Lead (Pb)-free and halogen-free
SiA938DJT-T1-GE3
ABSOLUTE MAXIMUM RATINGS (TA = 25 °C, unless otherwise noted)
PARAMETER
Drain-source voltage
Gate-source voltage
SYMBOL
LIMIT
20
+12 / -8
4.5 a
UNIT
VDS
VGS
V
T
C = 25 °C
C = 70 °C
T
4.5 a
Continuous drain current (TJ = 150 °C)
ID
TA = 25 °C
TA = 70 °C
4.5 a, b, c
4.5 a, b, c
30
4.5 a
1.6 b, c
7.8
5
1.9 b, c
1.2 b, c
-55 to +150
260
A
Pulsed drain current
IDM
IS
TC = 25 °C
TA = 25 °C
TC = 25 °C
TC = 70 °C
TA = 25 °C
TA = 70 °C
Continuous source-drain diode current
Maximum power dissipation
PD
W
Operating junction and storage temperature range
Soldering recommendations (peak temperature) d, e
TJ, Tstg
°C
THERMAL RESISTANCE RATINGS
PARAMETER
SYMBOL
RthJA
RthJC
TYPICAL
52
12.5
MAXIMUM
UNIT
Maximum junction-to-ambient b, f
t ≤ 5 s
Steady state
65
16
°C/W
Maximum junction-to-case (drain)
Notes
a. Package limited
b. Surface mounted on 1" x 1" FR4 board
c. t = 5 s
d. See solder profile (www.vishay.com/doc?73257). The PowerPAK SC-70 is a leadless package. The end of the lead terminal is exposed
copper (not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed
and is not required to ensure adequate bottom side solder interconnection
e. Rework conditions: manual soldering with a soldering iron is not recommended for leadless components
f. Maximum under steady state conditions is 110 °C/W
S21-0526-Rev. B, 31-May-2021
Document Number: 77643
1
For technical questions, contact: pmostechsupport@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000