SiA923EDJ
Vishay Siliconix
Dual P-Channel 20 V (D-S) MOSFET
FEATURES
PRODUCT SUMMARY
•
Halogen-free According to IEC 61249-2-21
VDS (V)
RDS(on) ()
ID (A)
Qg (Typ.)
Definition
TrenchFET® Power MOSFET
- 4.5a
- 4.5a
- 4.5a
- 1.5
•
•
0.054 at VGS = - 4.5 V
0.070 at VGS = - 2.5 V
0.104 at VGS = - 1.8 V
0.165 at VGS = - 1.5 V
New Thermally Enhanced PowerPAK® SC-70
Package
- 20
9.5 nC
- Small Footprint Area
- Low On-Resistance
•
•
•
Typical ESD Protection: 2500 V
100 % Rg Tested
Compliant to RoHS Directive 2002/95/EC
APPLICATIONS
PowerPAK SC-70-6 Dual
•
Charger Switches and Load Switches for Portable
Devices
S1
S2
•
DC/DC Converters
1
S1
Marking Code
2
G1
D K X
3
D1
D2
Part # code
X X X
D1
G1
G2
D2
Lot Traceability
6
and Date code
G2
5
2.05 mm
2.05 mm
S2
4
D1
D2
Ordering Information: SiA923EDJ-T1-GE3 (Lead (Pb)-free and Halogen-free)
P-Channel MOSFET
P-Channel MOSFET
ABSOLUTE MAXIMUM RATINGS T = 25 °C, unless otherwise noted
A
Parameter
Symbol
Limit
- 20
8
Unit
VDS
Drain-Source Voltage
Gate-Source Voltage
V
VGS
- 4.5a
T
C = 25 °C
- 4.5a
TC = 70 °C
TA = 25 °C
TA = 70 °C
Continuous Drain Current (TJ = 150 °C)
ID
- 4.5a, b, c
- 4.5a, b, c
- 15
- 4.5a
- 1.6b, c
7.8
A
IDM
IS
Pulsed Drain Current
TC = 25 °C
Continuous Source-Drain Diode Current
TA = 25 °C
TC = 25 °C
TC = 70 °C
TA = 25 °C
5
PD
Maximum Power Dissipation
W
1.9b, c
1.2b, c
TA = 70 °C
TJ, Tstg
- 55 to 150
260
Operating Junction and Storage Temperature Range
Soldering Recommendations (Peak Temperature)d, e
°C
THERMAL RESISTANCE RATINGS
Parameter
Maximum Junction-to-Ambientb, f
Maximum Junction-to-Case (Drain)
Symbol
RthJA
Typical
52
Maximum
Unit
t 5 s
65
16
°C/W
Steady State
RthJC
12.5
Notes:
a. Package limited.
b. Surface mounted on 1" x 1" FR4 board.
c. t = 5 s.
d. See solder profile (www.vishay.com/ppg?73257). The PowerPAK SC-70 is a leadless package. The end of the lead terminal is exposed copper
(not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed and is not
required to ensure adequate bottom side solder interconnection.
e. Rework conditions: manual soldering with a soldering iron is not recommended for leadless components.
f. Maximum under steady state conditions is 110 °C/W.
Document Number: 66803
S10-1535-Rev. A, 19-Jul-10
www.vishay.com
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