New Product
SiA929DJ
Vishay Siliconix
Dual P-Channel 30-V (D-S) MOSFET
FEATURES
PRODUCT SUMMARY
•
Halogen-free According to IEC 61249-2-21
VDS (V)
RDS(on) () Max.
0.064 at VGS = - 10 V
0.078 at VGS = - 4.5 V
0.120 at VGS = - 2.5 V
ID (A)
Qg (Typ.)
Definition
TrenchFET® Gen III Power MOSFET
Thermally Enhanced PowerPAK®
SC-70 Package
- 4.5a
- 4.5a
- 4.5a
•
•
- 30
6.6 nC
- Small Footprint Area
- Low On-Resistance
100 % Rg Tested
PowerPAK SC-70-6 Dual
•
1
• Compliant to RoHS Directive 2002/95/EC
S1
2
G1
APPLICATIONS
3
D1
D2
•
Load Switch and Battery Management for Smart Phones,
Tablet PCs and Portable Media Players
Fast Battery Charging
D1
6
D2
G2
•
5
2.05 mm
S2
2.05 mm
4
S
1
S
2
Marking Code
D N X
X X X
Part # code
G
1
G
2
Lot Traceability
and Date Code
Ordering Information:
SiA929DJ-T1-GE3 (Lead (Pb)-free and Halogen-free)
P-Channel MOSFET
P-Channel MOSFET
D
1
D
2
ABSOLUTE MAXIMUM RATINGS (T = 25 °C, unless otherwise noted)
A
Parameter
Drain-Source Voltage
Symbol
VDS
VGS
Limit
- 30
12
Unit
V
Gate-Source Voltage
- 4.5a
T
T
C = 25 °C
C = 70 °C
- 4.5a
Continuous Drain Current (TJ = 150 °C)
ID
- 4.3b, c
- 3.4b, c
- 15
- 4.5a
- 1.6b, c
7.8
TA = 25 °C
TA = 70 °C
A
IDM
IS
Pulsed Drain Current (t = 300 µs)
TC = 25 °C
TA = 25 °C
Continuous Source-Drain Diode Current
T
C = 25 °C
TC = 70 °C
TA = 25 °C
TA = 70 °C
5
PD
Maximum Power Dissipation
W
1.9b, c
1.2b, c
TJ, Tstg
Operating Junction and Storage Temperature Range
Soldering Recommendations (Peak Temperature)d, e
- 55 to 150
260
°C
THERMAL RESISTANCE RATINGS
Parameter
Maximum Junction-to-Ambientb, f
Maximum Junction-to-Case (Drain)
Symbol
RthJA
RthJC
Typical
52
Maximum
Unit
t 5 s
65
16
°C/W
Steady State
12.5
Notes:
a. Package limited.
b. Surface mounted on 1" x 1" FR4 board.
c. t = 5 s.
d. See Solder Profile (www.vishay.com/ppg?73257). The PowerPAK SC-70 is a leadless package. The end of the lead terminal is exposed
copper (not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed and
is not required to ensure adequate bottom side solder interconnection.
e. Rework Conditions: manual soldering with a soldering iron is not recommended for leadless components.
f. Maximum under Steady State conditions is 110 °C/W.
Document Number: 63398
S11-1654-Rev. A, 15-Aug-11
www.vishay.com
1
This document is subject to change without notice.
THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000