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SIA913ADJ

更新时间: 2024-09-28 01:16:31
品牌 Logo 应用领域
威世 - VISHAY /
页数 文件大小 规格书
9页 265K
描述
Dual P-Channel 12-V (D-S) MOSFET

SIA913ADJ 数据手册

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New Product  
SiA913ADJ  
Vishay Siliconix  
Dual P-Channel 12-V (D-S) MOSFET  
FEATURES  
PRODUCT SUMMARY  
Halogen-free According to IEC 61249-2-21  
VDS (V)  
RDS(on) (Ω)  
ID (A)  
Qg (Typ.)  
TrenchFET® Power MOSFET  
- 4.5a  
- 4.5a  
- 4.5a  
0.061 at VGS = - 4.5 V  
0.081 at VGS = - 2.5 V  
0.115 at VGS = - 1.8 V  
New Thermally Enhanced PowerPAK®  
SC-70 Package  
- 12  
8.2 nC  
- Small Footprint Area  
- Low On-Resistance  
APPLICATIONS  
PowerPAK SC-70-6 Dual  
Load Switch, PA Switch and Battery Switch for Portable  
Devices  
S
1
S
2
1
S1  
2
Marking Code  
G1  
G
1
G
2
3
D1  
D I X  
D2  
Part # code  
D1  
6
X X X  
D2  
Lot Traceability  
and Date code  
G2  
5
2.05 mm  
2.05 mm  
S2  
4
D
1
D
2
P-Channel MOSFET P-Channel MOSFET  
Ordering Information:  
SiA913ADJ-T1-GE3 (Lead (Pb)-free and Halogen-free)  
ABSOLUTE MAXIMUM RATINGS T = 25 °C, unless otherwise noted  
A
Parameter  
Drain-Source Voltage  
Gate-Source Voltage  
Symbol  
VDS  
Limit  
- 12  
8
Unit  
V
VGS  
- 4.5a  
T
C = 25 °C  
- 4.5a  
TC = 70 °C  
TA = 25 °C  
TA = 70 °C  
Continuous Drain Current (TJ = 150 °C)  
ID  
- 4.3b, c  
- 3.8b, c  
- 15  
- 4.5a  
- 1.6b, c  
6.5  
A
IDM  
IS  
Pulsed Drain Current  
TC = 25 °C  
Continuous Source-Drain Diode Current  
TA = 25 °C  
TC = 25 °C  
TC = 70 °C  
TA = 25 °C  
5
PD  
Maximum Power Dissipation  
W
1.9b, c  
1.2b, c  
TA = 70 °C  
Operating Junction and Storage Temperature Range  
Soldering Recommendations (Peak Temperature)d, e  
TJ, Tstg  
- 55 to 150  
260  
°C  
THERMAL RESISTANCE RATINGS  
Parameter  
Maximum Junction-to-Ambientb, f  
Maximum Junction-to-Case (Drain)  
Symbol  
RthJA  
Typical  
52  
Maximum  
Unit  
t 5 s  
65  
16  
°C/W  
RthJC  
Steady State  
12.5  
Notes:  
a. Package limited.  
b. Surface Mounted on 1" x 1" FR4 board.  
c. t = 5 s.  
d. See Solder Profile (www.vishay.com/ppg?73257). The PowerPAK SC-70 is a leadless package. The end of the lead terminal is exposed  
copper (not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed and  
is not required to ensure adequate bottom side solder interconnection.  
e. Rework Conditions: manual soldering with a soldering iron is not recommended for leadless components.  
f. Maximum under Steady State conditions is 110 °C/W.  
Document Number: 64723  
S09-0141-Rev. A, 02-Feb-09  
www.vishay.com  
1

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