Datasheet > SiA918EDJ

SiA918EDJ

更新时间： 2024-09-28 14:55:27

品牌	Logo	应用领域
威世 - VISHAY		/
页数	文件大小	规格书
9页	379K
描述
Dual N-Channel 30 V (D-S) MOSFET

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SiA918EDJ 数据手册

SiA918EDJ

Vishay Siliconix

www.vishay.com

Dual N-Channel 30 V (D-S) MOSFET

FEATURES

• TrenchFET^®power MOSFET

• Thermally enhanced PowerPAK^®SC-70 package

- Small footprint area

- Low on-resistance

• Typical ESD protection: 1000 V (HBM)

• 100 % R_gtested

PRODUCT SUMMARY

V_DS(V)

R_DS(on)() MAX.

0.058 at V_GS= 4.5 V

0.065 at V_GS= 2.5 V

0.077 at V_GS= 1.8 V

I_D(A)

4.5 ^a

Q_g(TYP.)

3.6 nC

• Material categorization: for definitions of compliance

please see www.vishay.com/doc?99912

PowerPAK^®SC-70-6L Dual

D₁

G₂

S₂

APPLICATIONS

• Portable devices such as smart phones, tablet PCs and

mobile computing

D₁

D₂

- Load switch

- DC/DC converter

- Power management

G₁

S₁

D₁

D₂

Top View

Bottom View

G₁

G₂

Marking Code: CL

Ordering Information:

SiA918EDJ-T1-GE3 (lead (Pb)-free and halogen free)

S₁

S₂

N-Channel MOSFET

ABSOLUTE MAXIMUM RATINGS (T_A= 25 °C, unless otherwise noted)

PARAMETER

SYMBOL

LIMIT

UNIT

Drain-Source Voltage

Gate-Source Voltage

V_DS

V_GS

T_C= 25 °C

4.5 ^a

T_C= 70 °C

T_A= 25 °C

T_A= 70 °C

4.5 ^a

Continuous Drain Current (T_J= 150 °C)

I_D

4.4 ^{b, c}

3.5 ^{b, c}

4.5 ^a

1.6 ^{b, c}

Pulsed Drain Current (t = 100 μs)

I_DM

I_S

T_C= 25 °C

Continuous Source-Drain Diode Current

T_A= 25 °C

_C= 25 °C

_C= 70 °C

7.8

Maximum Power Dissipation

P_D

T_A= 25 °C

T_A= 70 °C

1.9 ^{b, c}

1.2 ^{b, c}

-55 to +150

260

Operating Junction and Storage Temperature Range

Soldering Recommendations (Peak Temperature) ^d,e

T_J, T_stg

°C

THERMAL RESISTANCE RATINGS

PARAMETER

Maximum Junction-to-Ambient ^{b, f}

SYMBOL

TYPICAL

MAXIMUM

UNIT

t  5 s

Steady State

R_thJA

R_thJC

°C/W

Maximum Junction-to-Case (Drain)

12.5

Notes

a. Package limited.

b. Surface mounted on 1" x 1" FR4 board.

c. t = 5 s.

d. See solder profile (www.vishay.com/doc?73257). The PowerPAK SC-70 is a leadless package. The end of the lead terminal is exposed

copper (not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed

and is not required to ensure adequate bottom side solder interconnection.

e. Rework conditions: manual soldering with a soldering iron is not recommended for leadless components.

f. Maximum under steady state condition is 110 °C/W.

S16-1004-Rev. A, 30-May-16

Document Number: 79034

For technical questions, contact: pmostechsupport@vishay.com

THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT

ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000

12 3 4 5 6 7...9

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