Datasheet > SIA920DJ

SIA920DJ

更新时间： 2024-09-27 11:57:31

品牌	Logo	应用领域
威世 - VISHAY		/
页数	文件大小	规格书
7页	140K
描述
Dual N-Channel 8 V (D-S) MOSFET

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SIA920DJ 数据手册

New Product

SiA920DJ

Vishay Siliconix

Dual N-Channel 8 V (D-S) MOSFET

FEATURES

PRODUCT SUMMARY

•

Halogen-free According to IEC 61249-2-21

V_DS(V)

R_DS(on)()

Q_g(Typ.)

Definition

_D(A)^a

•

TrenchFET^®Power MOSFET

0.027 at V_GS= 4.5 V

0.031 at V_GS= 2.5 V

0.036 at Vgs = 1.8 V

0.047 at Vgs = 1.5 V

0.110 at Vgs = 1.2 V

4.5

1.5

Thermally Enhanced PowerPAK^®

SC-70 Package

4.8 nC

- Small Footprint Area

- Low On-Resistance

100 % R_gTested

•

• Compliant to RoHS Directive 2002/95/EC

PowerPAK SC-70-6 Dual

APPLICATIONS

•

Load Switch with Low Voltage Drop

Load Switch for 1.2 V/1.5 V/1.8 V Power Lines

Smart Phones, Tablet PCs, Portable Media Players

S₁

G₁

D₁

D₂

D₁

D₂

D₁

D₂

G₂

2.05 mm

S₂

G₁

G₂

Ordering Information: SiA920DJ-T1-GE3 (Lead (Pb)-free and Halogen-free)

Marking Code

N-Channel MOSFET

S₁

S₂

C H X

Part # code

X X X

Lot Traceability

and Date code

ABSOLUTE MAXIMUM RATINGS (T = 25 °C, unless otherwise noted)

Parameter

Symbol

Limit

Unit

Drain-Source Voltage

Gate-Source Voltage

V_DS

V_GS

4.5^a

4.5^{a, b, c}

4.5^a

1.6^{b, c}

7.8

T_C= 25 °C

T_C= 70 °C

T_A= 25 °C

T_A= 70 °C

Continuous Drain Current (T_J= 150 °C)

I_D

I_DM

I_S

Pulsed Drain Current (t = 300 µs)

_C= 25 °C

Continuous Source-Drain Diode Current

T_A= 25 °C

T_C= 25 °C

_C= 70 °C

P_D

Maximum Power Dissipation

1.9^{b, c}

T_A= 25 °C

T_A= 70 °C

1.2^{b, c}

- 55 to 150

260

T_J, T_stg

Operating Junction and Storage Temperature Range

Soldering Recommendations (Peak Temperature)^{d, e}

°C

THERMAL RESISTANCE RATINGS

Parameter

Maximum Junction-to-Ambient^{b, f}

Maximum Junction-to-Case (Drain)

Symbol

R_thJA

R_thJC

Typical

Maximum

Unit

t  5 s

Steady State

°C/W

12.5

Notes:

a. Package limited

b. Surface mounted on 1" x 1" FR4 board.

c. t = 5 s.

d. See solder profile (www.vishay.com/ppg?73257). The PowerPAK SC-70 is a leadless package. The end of the lead terminal is exposed

copper (not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed

and is not required to ensure adequate bottom side solder interconnection.

e. Rework conditions: manual soldering with a soldering iron is not recommended for leadless components.

f. Maximum under steady state conditions is 110 °C/W.

Document Number: 63299

S11-1381-Rev. A, 11-Jul-11

www.vishay.com

This document is subject to change without notice.

THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000

12 3 4 5 6 7

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