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SiA485DJ PDF预览

SiA485DJ

更新时间: 2024-11-07 14:55:39
品牌 Logo 应用领域
威世 - VISHAY /
页数 文件大小 规格书
9页 243K
描述
P-Channel 150 V (D-S) MOSFET

SiA485DJ 数据手册

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SiA485DJ  
Vishay Siliconix  
www.vishay.com  
P-Channel 150 V (D-S) MOSFET  
FEATURES  
• TrenchFET® power MOSFET  
• Thermally enhanced PowerPAK® SC-70 package  
- Small footprint area  
- Low on-resistance  
PRODUCT SUMMARY  
VDS (V)  
RDS(on) (Ω) MAX.  
2.6 at VGS = -10 V  
2.7 at VGS = -6 V  
ID (A)  
-1.6 a  
-1.6 a  
Qg (Typ.)  
-150  
4.2 nC  
PowerPAK® SC-70-6L Single  
• 100 % Rg and UIS tested  
D
• Material categorization: for definitions of compliance  
please see www.vishay.com/doc?99912  
D
5
6
S
4
APPLICATIONS  
S
• Active clamp switch  
S
7
• Load switch  
1
D
2
D
G
3
1
G
Top View  
Bottom View  
Marking Code: B4  
P-Channel MOSFET  
D
Ordering Information:  
SiA485DJ-T1-GE3 (Lead (Pb)-free and halogen-free)  
ABSOLUTE MAXIMUM RATINGS (TA = 25 °C, unless otherwise noted)  
PARAMETER  
SYMBOL  
VDS  
LIMIT  
-150  
UNIT  
Drain-Source Voltage  
Gate-Source Voltage  
V
VGS  
20  
T
T
C = 25 °C  
C = 70 °C  
-1.6  
-1.3  
Continuous Drain Current (TJ = 150 °C)  
ID  
TA = 25 °C  
TA = 70 °C  
-0.7 b, c  
-0.57 b, c  
-2  
A
Pulsed Drain Current (t = 100 μs)  
IDM  
IS  
T
C = 25 °C  
-1.6  
-1.6 b, c  
Continuous Source-Drain Diode Current  
TA = 25 °C  
Avalanche Current  
IAS  
-1.5  
L = 0.1 mH  
Single Pulse Avalanche Energy  
EAS  
0.1  
mJ  
W
T
T
C = 25 °C  
C = 70 °C  
15.6  
10  
Maximum Power Dissipation  
PD  
TA = 25 °C  
TA = 70 °C  
2.9 b, c  
1.8 b, c  
-55 to +150  
260  
Operating Junction and Storage Temperature Range  
Soldering Recommendations (Peak Temperature) d, e  
TJ, Tstg  
°C  
THERMAL RESISTANCE RATINGS  
PARAMETER  
Maximum Junction-to-Ambient b, f  
SYMBOL  
RthJA  
TYPICAL  
MAXIMUM  
UNIT  
t 5 s  
32  
6
43  
8
°C/W  
Maximum Junction-to-Case (Drain)  
Steady State  
RthJC  
Notes  
a. TC = 25 °C.  
b. Surface mounted on 1" x 1" FR4 board.  
c. t = 5 s.  
d. See solder profile (www.vishay.com/doc?73257). The PowerPAK SC-70 is a leadless package. The end of the lead terminal is exposed  
copper (not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed  
and is not required to ensure adequate bottom side solder interconnection.  
e. Rework conditions: manual soldering with a soldering iron is not recommended for leadless components.  
f. Maximum under steady state conditions is 80 °C/W.  
S14-2235-Rev. A, 10-Nov-14  
Document Number: 62988  
1
For technical questions, contact: pmostechsupport@vishay.com  
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT  
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000  

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