SiA471DJ
Vishay Siliconix
www.vishay.com
P-Channel 30 V (D-S) MOSFET
FEATURES
• TrenchFET® Gen IV p-channel power MOSFET
• Thermally enhanced PowerPAK® SC-70 package
PowerPAK® SC-70-6L Single
D
D
5
6
S
4
• Very low RDS(on) x area minimizes power loss on
limited PCB real estate
• Provides excellent RDS-Qg Figure-of-Merit (FOM)
for switching applications
S
7
1
D
• 100 % Rg tested
2
D
3
G
1
• Material categorization: for definitions of compliance
please see www.vishay.com/doc?99912
Top View
Bottom View
PRODUCT SUMMARY
VDS (V)
APPLICATIONS
S
-30
0.0140
0.0241
8.9
• Battery charging and management
RDS(on) max. () at VGS = -10 V
RDS(on) max. () at VGS = -4.5 V
Qg typ. (nC)
G
• Load switch
• DC/DC converters
• Power management in battery-operated,
mobile and wearable devices
ID (A)
-30.3
Single
P-Channel
MOSFET
Configuration
D
Marking code: B9
ORDERING INFORMATION
Package
PowerPAK SC-70
SiA471DJ-T1-GE3
Lead (Pb)-free and halogen-free
ABSOLUTE MAXIMUM RATINGS (TA = 25 °C, unless otherwise noted)
PARAMETER
SYMBOL
LIMIT
-30
UNIT
Drain-source voltage
Gate-source voltage
VDS
V
VGS
-20 / +16
-30.3
TC = 25 °C
TC = 70 °C
TA =25 °C
TA = 70 °C
-24.2
Continuous drain current (TJ = 150 °C)
ID
-12.9 a, b
-10.3 a, b
-70
A
Pulsed drain current (t = 100 μs)
IDM
IS
TC = 25 °C
TA = 25 °C
TC = 25 °C
TC = 70 °C
TA = 25 °C
TA = 70 °C
-16
-2.9 a, b
Continuous source-drain diode current
19.2
12.3
Maximum power dissipation
PD
W
3.5 a, b
2.2 a, b
-55 to +150
260
Operating junction and storage temperature range
Soldering recommendations (peak temperature) c, d
TJ, Tstg
°C
THERMAL RESISTANCE RATINGS
PARAMETER
Maximum junction-to-ambient a, e
SYMBOL
RthJA
TYPICAL
28
MAXIMUM
UNIT
t 5 s
Steady state
36
°C/W
Maximum junction-to-case (drain)
Notes
RthJC
5.3
6.5
a. Surface mounted on 1" x 1" FR4 board
b. t = 5 s
c. See solder profile (www.vishay.com/ppg?73257). The PowerPAK SC-70 is a leadless package. The end of the lead terminal is exposed
copper (not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed
and is not required to ensure adequate bottom side solder interconnection
d. Rework conditions: manual soldering with a soldering iron is not recommended for leadless components
e. Maximum under steady state conditions is 80 °C/W
S19-0336-Rev. B, 08-Apr-2019
Document Number: 76741
1
For technical questions, contact: pmostechsupport@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000