Datasheet > SiA461DJ

SiA461DJ

更新时间： 2024-09-17 14:55:35

品牌	Logo	应用领域
威世 - VISHAY		/
页数	文件大小	规格书
9页	251K
描述
P-Channel 20 V (D-S) MOSFET

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SiA461DJ 数据手册

SiA461DJ

Vishay Siliconix

www.vishay.com

P-Channel 20 V (D-S) MOSFET

FEATURES

• TrenchFET^®power MOSFET

• Thermally enhanced PowerPAK^®SC-70 package

- Small footprint area

PowerPAK^®SC-70-6L Single

- Low on-resistance

• Material categorization:

for definitions of compliance please see

www.vishay.com/doc?99912

Top View

Bottom View

APPLICATIONS

Marking code: BV

(4) S

• Smart phones, tablet PCs, mobile

computing

- Battery switch

PRODUCT SUMMARY

V_DS(V)

-20

(3) G

- Charger switch

_DS(on)max. () at V_GS= -4.5 V

_DS(on)max. () at V_GS= -2.5 V

_DS(on)max. () at V_GS= -1.8 V

0.033

0.042

0.055

- Load switch

(1, 2, 5, 6) D

Q_gtyp. (nC)

_D(A) ^a

Configuration

P-Channel MOSFET

-12

Single

ORDERING INFORMATION

Package

Lead (Pb)-free and halogen-free

PowerPAK SC-70

SiA461DJ-T1-GE3

ABSOLUTE MAXIMUM RATINGS (T_A= 25 °C, unless otherwise noted)

PARAMETER

SYMBOL

LIMIT

-20

UNIT

Drain-source voltage

Gate-source voltage

V_DS

V_GS

_C= 25 °C

_C= 70 °C

-12 ^a

Continuous drain current (T_J= 150 °C)

I_D

T_A= 25 °C

T_A= 70 °C

-8.3 ^{b, c}

-6.6 ^{b, c}

-20

Pulsed drain current (t = 300 μs)

I_DM

I_S

T_C= 25 °C

T_A= 25 °C

-12 ^a

-2.8 ^{b, c}

Continuous source-drain diode current

T_C= 25 °C

17.9

T_C= 70 °C

T_A= 25 °C

T_A= 70 °C

11.4

Maximum power dissipation

P_D

3.4 ^{b, c}

2.2 ^{b, c}

-55 to +150

260

Operating junction and storage temperature range

Soldering recommendations (peak temperature) ^{d, e}

T_J, T_stg

°C

THERMAL RESISTANCE RATINGS

PARAMETER

Maximum junction-to-ambient ^{b, f}

Maximum junction-to-case (drain)

SYMBOL

TYPICAL

MAXIMUM

UNIT

t  5 s

Steady state

R_thJA

R_thJC

°C/W

5.5

Notes

a. Package limited

b. Surface mounted on 1" x 1" FR4 board

c. t = 5 s

d. See solder profile (www.vishay.com/doc?73257). The PowerPAK SC-70 is a leadless package. The end of the lead terminal is exposed

copper (not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed

and is not required to ensure adequate bottom side solder interconnection

e. Rework conditions: manual soldering with a soldering iron is not recommended for leadless components

f. Maximum under steady state conditions is 80 °C/W

S12-0539-Rev. A, 12-Mar-12

Document Number: 63838

For technical questions, contact: pmostechsupport@vishay.com

THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT

ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000

12 3 4 5 6 7...9

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