Datasheet > SIA453EDJ-T1-GE3

SIA453EDJ-T1-GE3

更新时间： 2024-11-09 22:52:19

品牌	Logo	应用领域
威世 - VISHAY		/
页数	文件大小	规格书
9页	218K
描述
MOSFET P-CH 30V 24A PPAK SC-70-6

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SIA453EDJ-T1-GE3 数据手册

SiA453EDJ

Vishay Siliconix

www.vishay.com

P-Channel 30 V (D-S) MOSFET

FEATURES

PRODUCT SUMMARY

• TrenchFET^®Power MOSFET

V_DS(V)

R_DS(on)() (Max.)

0.0185 at V_GS= - 10 V

0.0235 at V_GS= - 4.5 V

0.0260 at V_GS= - 3.7 V

0.0377 at V_GS= - 2.5 V

I_D(A)^a

- 24

Q_g(Typ.)

• Thermally Enhanced PowerPAK^®SC-70 Package

- Small Footprint Area

- Low On-Resistance

• 100 % R_gand UIS Tested

- 21

- 30

21 nC

- 20

• Typical ESD Protection: 4000 V (HBM)

- 10

• Material categorization: For definitions of compliance

please see www.vishay.com/doc?99912

PowerPAK SC-70-6L-Single

APPLICATIONS

• Portable Devices such as Smart Phones,

Tablet PCs and Mobile Computing

- Load Switch

- Power Management

- Input Protection Switch (over 

voltage, reverse voltage)

Marking Code

2.05 mm

B 2 X

Part # code

Ordering Information:

SiA453EDJ-T1-GE3 (Lead (Pb)-free and Halogen-free)

X X X

Lot Traceability

and Date code

P-Channel MOSFET

ABSOLUTE MAXIMUM RATINGS (T_C= 25 °C, unless otherwise noted)

Parameter

Symbol

Limit

- 30

Unit

Drain-Source Voltage

Gate-Source Voltage

V_DS

V_GS

_C= 25 °C

_C= 70 °C

- 24

- 19

Continuous Drain Current (T_J= 150 °C)

I_D

T_A= 25 °C

T_A= 70 °C

- 10^{b, c}

- 8^{b, c}

- 80

Pulsed Drain Current (t = 100 μs)

I_DM

I_S

_C= 25 °C

- 16

- 2.9^{b, c}

Continuous Source-Drain Diode Current

T_A= 25 °C

Single Avalanche Current

Single Avalanche Energy

I_AS

- 10

L = 0.1 mH

E_AS

_C= 25 °C

_C= 70 °C

Maximum Power Dissipation

P_D

T_A= 25 °C

T_A= 70 °C

3.5^{b, c}

2.2^{b, c}

- 50 to 150

260

Operating Junction and Storage Temperature Range

Soldering Recommendations (Peak Temperature)^{d, e}

T_J, T_stg

°C

THERMAL RESISTANCE RATINGS

Parameter

Maximum Junction-to-Ambient^{b, f}

Symbol

R_thJA

Typical

Maximum

Unit

t  5 s

°C/W

Maximum Junction-to-Case (Drain)

Steady State

R_thJC

5.3

6.5

Notes

a. T_C= 25 °C.

b. Surface mounted on 1" x 1" FR4 board.

c. t = 5 s.

d. See solder profile (www.vishay.com/doc?73257). The PowerPAK SC-70 is a leadless package. The end of the lead terminal is exposed

copper (not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed

and is not required to ensure adequate bottom side solder interconnection.

e. Rework conditions: manual soldering with a soldering iron is not recommended for leadless components.

f. Maximum under steady state conditions is 80 °C/W.

S13-1271-Rev. A, 27-May-13

Document Number: 62864

For technical questions, contact: pmostechsupport@vishay.com

THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT

ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000

12 3 4 5 6 7...9

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与SIA453EDJ-T1-GE3相关器件

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