Datasheet > SIA444DJT_11

SIA444DJT_11

更新时间： 2024-09-16 09:25:39

品牌	Logo	应用领域
威世 - VISHAY		/
页数	文件大小	规格书
8页	158K
描述
N-Channel 30 V (D-S) MOSFET

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SIA444DJT_11 数据手册

New Product

SiA444DJT

Vishay Siliconix

N-Channel 30 V (D-S) MOSFET

FEATURES

PRODUCT SUMMARY

•

Halogen-free According to IEC 61249-2-21

V_DS(V)

R_DS(on)()

I_D(A)^a

Q_g(Typ.)

Definition

•

TrenchFET^®Power MOSFET

0.017 at V_GS= 10 V

0.022 at V_GS= 4.5 V

5 nC

New Thermally Enhanced PowerPAK^®

SC-70 Package

- Small Footprint Area

Thin PowerPAK SC-70-6L-Single

- Ultra-Thin 0.6 mm height

Compliant to RoHS Directive 2002/95/EC

•

APPLICATIONS

•

DC/DC Converter

•

High Frequency Switching

0.6 mm

2.05 mm

Marking Code

A M X

X X X

Part # code

Lot Traceability

and Date code

N-Channel MOSFET

Ordering Information:

SiA444DJT-T1-GE3 (Lead (Pb)-free and Halogen-free)

ABSOLUTE MAXIMUM RATINGS (T = 25 °C, unless otherwise noted)

Parameter

Symbol

Limit

Unit

Drain-Source Voltage

Gate-Source Voltage

V_DS

V_GS

12^a

_C= 25 °C

12^a

T_C= 70 °C

T_A= 25 °C

T_A= 70 °C

Continuous Drain Current (T_J= 150 °C)

I_D

11^{a, b, c}

8.8^{b, c}

12^a

2.9^{b, c}

I_DM

I_S

Pulsed Drain Current (t = 300 µs)

_C= 25 °C

Continuous Source-Drain Diode Current

T_A= 25 °C

_C= 25 °C

_C= 70 °C

_A= 25 °C

Maximum Power Dissipation

P_D

3.5^{b, c}

2.2^{b, c}

- 55 to 150

260

T_A= 70 °C

T_J, T_stg

Operating Junction and Storage Temperature Range

Soldering Recommendations (Peak Temperature)^{d, e}

°C

THERMAL RESISTANCE RATINGS

Parameter

Maximum Junction-to-Ambient^{b, f}

Symbol

Typical

Maximum

Unit

t  5 s

Steady State

R_thJA

R_thJC

°C/W

5.3

6.5

Maximum Junction-to-Case (Drain)

Notes:

a. Package limited

b. Surface mounted on 1" x 1" FR4 board.

c. t = 5 s.

d. See solder profile (www.vishay.com/ppg?73257). The Thin PowerPAK SC-70 is a leadless package. The end of the lead terminal is exposed

copper (not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed

and is not required to ensure adequate bottom side solder interconnection.

e. Rework conditions: manual soldering with a soldering iron is not recommended for leadless components.

f. Maximum under steady state conditions is 80 °C/W.

Document Number: 67056

S11-1655-Rev. C, 15-Aug-11

www.vishay.com

This document is subject to change without notice.

THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000

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