SiA445EDJ
Vishay Siliconix
www.vishay.com
P-Channel 20 V (D-S) MOSFET
FEATURES
• TrenchFET® power MOSFET
PowerPAK® SC-70-6L Single
D
D
5
6
S
4
• Thermally enhanced PowerPAK SC-70 package
- Small footprint area
- Low on-resistance
• 100 % Rg tested
S
7
1
D
• Built in ESD protection with Zener diode
• Typical ESD performance: 2000 V
2
D
3
G
1
Top View
• Material categorization: for definitions of compliance
please see www.vishay.com/doc?99912
Bottom View
Marking code: BQ
APPLICATIONS
S
PRODUCT SUMMARY
VDS (V)
-20
• Smart phones, tablet PCs,
mobile computing
- Battery switch
- Charger switch
- Load switch
RDS(on) max. () at VGS = -4.5 V
0.0165
0.0185
0.0300
23
R
DS(on) max. () at VGS = -3.7 V
DS(on) max. () at VGS = -2.5 V
G
R
Qg typ. (nC)
D (A) a
Configuration
I
-12
P-Channel MOSFET
Single
D
ORDERING INFORMATION
Package
PowerPAK SC-70
Lead (Pb)-free and halogen-free
SiA445EDJ-T1-GE3
ABSOLUTE MAXIMUM RATINGS (TA = 25 °C, unless otherwise noted)
PARAMETER
SYMBOL
LIMIT
-20
UNIT
Drain-source voltage
Gate-source voltage
VDS
V
VGS
12
TC = 25 °C
C = 70 °C
-12 a
-12 a
-11.8 b, c
-9.5 b, c
-50
-12 a
-2.9 b, c
19
T
Continuous drain current (TJ = 150 °C)
ID
TA = 25 °C
TA = 70 °C
A
Pulsed drain current (t = 300 μs)
IDM
IS
TC = 25 °C
Continuous source-drain diode current
TA = 25 °C
TC = 25 °C
T
C = 70 °C
12
3.5 b, c
2.2 b, c
Maximum power dissipation
PD
W
TA = 25 °C
TA = 70 °C
Operating junction and storage temperature range
Soldering recommendations (peak temperature) d, e
TJ, Tstg
-55 to +150
260
°C
THERMAL RESISTANCE RATINGS
PARAMETER
Maximum junction-to-ambient b, f
Maximum junction-to-case (drain)
SYMBOL
RthJA
RthJC
TYPICAL
MAXIMUM
UNIT
t 5 s
Steady state
28
5.3
36
6.5
°C/W
Notes
a. Package limited
b. Surface mounted on 1" x 1" FR4 board
c. t = 5 s
d. See solder profile (www.vishay.com/doc?73257). The PowerPAK SC-70-6L is a leadless package. The end of the lead terminal is exposed
copper (not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed
and is not required to ensure adequate bottom side solder interconnection
e. Rework conditions: manual soldering with a soldering iron is not recommended for leadless components
f. Maximum under steady state conditions is 80 °C/W
S11-2525-Rev. A, 26-Dec-11
Document Number: 63619
1
For technical questions, contact: pmostechsupport@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000