Datasheet > SiA445EDJT

SiA445EDJT

更新时间： 2024-09-17 14:53:19

品牌	Logo	应用领域
威世 - VISHAY		/
页数	文件大小	规格书
10页	333K
描述
P-Channel 20 V (D-S) MOSFET

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SiA445EDJT 数据手册

SiA445EDJT

Vishay Siliconix

www.vishay.com

P-Channel 20 V (D-S) MOSFET

FEATURES

PRODUCT SUMMARY

• TrenchFET^®power MOSFET

V_DS(V)

R_DS(on)() MAX.

I_D(A)

-12 ^a

Q_g(TYP.)

• Thermally enhanced PowerPAK^®SC-70 package

- Small footprint area

- Low on-resistance

0.0167 at V_GS= -4.5 V

0.0185 at V_GS= -3.7 V

0.0310 at V_GS= -2.5 V

-20

22 nC

• Ultra-thin 0.6 mm height

• 100 % R_gtested

Thin PowerPAK^®SC-70-6L Single

• Built in ESD protection with Zener diode

• Typical ESD performance: 2000 V

• Material categorization: for definitions of compliance

please see www.vishay.com/doc?99912

0.6 mm

APPLICATIONS

• Smart phones, tablet PCs, mobile

computing 

- Battery switch

- Charger switch

- Load switch

Top View

Bottom View

Marking Code: B6

Ordering Information:

SiA445EDJT-T1-GE3 (lead (Pb)-free and halogen-free)

P-Channel MOSFET

ABSOLUTE MAXIMUM RATINGS (T_A= 25 °C, unless otherwise noted)

PARAMETER

SYMBOL

V_DS

LIMIT

-20

UNIT

Drain-Source Voltage

Gate-Source Voltage

V_GS

T_C= 25 °C

-12 ^a

T_C= 70 °C

T_A= 25 °C

T_A= 70 °C

-12 ^a

Continuous Drain Current (T_J= 150 °C)

I_D

-11.8 ^{b, c}

-9.5 ^{b, c}

-50

-12 ^a

-2.9 ^{b, c}

Pulsed Drain Current (t = 100 μs)

I_DM

I_S

_C= 25 °C

T_A= 25 °C

_C= 25 °C

Continuous Source-Drain Diode Current

T_C= 70 °C

T_A= 25 °C

T_A= 70 °C

Maximum Power Dissipation

P_D

3.5 ^{b, c}

2.2 ^{b, c}

-55 to +150

260

Operating Junction and Storage Temperature Range

Soldering Recommendations (Peak temperature) ^{d, e}

T_J, T_stg

°C

THERMAL RESISTANCE RATINGS

PARAMETER

Maximum Junction-to-Ambient ^{b, f}

SYMBOL

R_thJA

TYPICAL

MAXIMUM

UNIT

t  5 s

°C/W

Maximum Junction-to-Case (Drain)

Steady state

R_thJC

5.3

6.5

Notes

a. Package limited.

b. Surface mounted on 1" x 1" FR4 board.

c. t = 5 s.

d. See solder profile (www.vishay.com/doc?73257). The PowerPAK SC-70 is a leadless package. The end of the lead terminal is exposed

copper (not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed

and is not required to ensure adequate bottom side solder interconnection.

e. Rework conditions: manual soldering with a soldering iron is not recommended for leadless components.

f. Maximum under steady state conditions is 80 °C/W.

S16-1069-Rev. A, 30-May-16

Document Number: 67437

For technical questions, contact: pmostechsupport@vishay.com

THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT

ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000

12 3 4 5 6 7...10

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与SiA445EDJT相关器件

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