Datasheet > SIA433EDJ

SIA433EDJ

更新时间： 2024-09-16 09:25:39

品牌	Logo	应用领域
威世 - VISHAY		/
页数	文件大小	规格书
9页	226K
描述
P-Channel 20-V (D-S) MOSFET

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SIA433EDJ 数据手册

New Product

SiA433EDJ

Vishay Siliconix

P-Channel 20-V (D-S) MOSFET

FEATURES

PRODUCT SUMMARY

•

Halogen-free According to IEC 61249-2-21

V_DS(V)

R_DS(on)(Ω)

I_D(A)

Q_g(Typ.)

Definition

- 12^a

- 4

•

TrenchFET^®Power MOSFET

0.018 at V_GS= - 4.5 V

0.026 at V_GS= - 2.5 V

0.065 at V_GS= - 1.8 V

New Thermally Enhanced PowerPAK^®

SC-70 Package

- 20

20 nC

- Small Footprint Area

- Low On-Resistance

•

100 % R_gTested

Built in ESD Protection with Zener Diode

Typical ESD Performance: 1800 V

Compliant to RoHS Directive 2002/95/EC

PowerPAK SC-70-6L-Single

APPLICATIONS

•

Portable Devices

- Load Switch

- Battery Switch

- Charger Switch

Marking Code

B L X

X X X

2.05 mm

Part # code

Lot Traceability

and Date code

P-Channel MOSFET

Ordering Information: SiA433EDJ-T1-GE3 (Lead (Pb)-free and Halogen-free)

ABSOLUTE MAXIMUM RATINGS T = 25 °C, unless otherwise noted

Parameter

Symbol

Limit

- 20

Unit

Drain-Source Voltage

Gate-Source Voltage

V_DS

V_GS

- 12^a

T_C= 25 °C

T_C= 70 °C

T_A= 25 °C

T_A= 70 °C

- 12^a

Continuous Drain Current (T_J= 150 °C)

I_D

- 11.3^{b, c}

- 9.1^{b, c}

- 50

- 12^a

- 2.9^{b, c}

Pulsed Drain Current

I_DM

I_S

T_C= 25 °C

Continuous Source-Drain Diode Current

T_A= 25 °C

T_C= 25 °C

_C= 70 °C

Maximum Power Dissipation

P_D

3.5^{b, c}

2.2^{b, c}

T_A= 25 °C

T_A= 70 °C

Operating Junction and Storage Temperature Range

Soldering Recommendations (Peak Temperature)^{d, e}

T_J, T_stg

- 55 to 150

°C

260

THERMAL RESISTANCE RATINGS

Parameter

Maximum Junction-to-Ambient^{b, f}

Maximum Junction-to-Case (Drain)

Symbol

R_thJA

Typical

Maximum

Unit

t ≤ 5 s

Steady State

°C/W

R_thJC

5.3

6.5

Notes:

a. Package limited.

b. Surface Mounted on 1" x 1" FR4 board.

c. t = 5 s.

d. See Solder Profile (www.vishay.com/ppg?73257). The PowerPAK SC-70 is a leadless package. The end of the lead terminal is exposed

copper (not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed and

is not required to ensure adequate bottom side solder interconnection.

e. Rework Conditions: manual soldering with a soldering iron is not recommended for leadless components.

f. Maximum under Steady State conditions is 80 °C/W.

Document Number: 65472

S09-2114-Rev. A, 12-Oct-09

www.vishay.com

12 3 4 5 6 7...9

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