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IXFR36N50P PDF预览

IXFR36N50P

更新时间: 2024-11-05 11:14:07
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IXYS 晶体晶体管功率场效应晶体管开关脉冲局域网
页数 文件大小 规格书
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描述
PolarHV HiPerFET Power MOSFET

IXFR36N50P 技术参数

是否无铅: 不含铅生命周期:Transferred
包装说明:IN-LINE, R-PSIP-T3针数:3
Reach Compliance Code:unknown风险等级:5.75
Is Samacsys:N其他特性:AVALANCHE RATED, UL RECOGNIZED
雪崩能效等级(Eas):1500 mJ外壳连接:ISOLATED
配置:SINGLE WITH BUILT-IN DIODE最小漏源击穿电压:500 V
最大漏极电流 (ID):19 A最大漏源导通电阻:0.19 Ω
FET 技术:METAL-OXIDE SEMICONDUCTORJESD-30 代码:R-PSIP-T3
JESD-609代码:e1元件数量:1
端子数量:3工作模式:ENHANCEMENT MODE
最高工作温度:150 °C封装主体材料:PLASTIC/EPOXY
封装形状:RECTANGULAR封装形式:IN-LINE
峰值回流温度(摄氏度):NOT SPECIFIED极性/信道类型:N-CHANNEL
最大脉冲漏极电流 (IDM):100 A认证状态:Not Qualified
表面贴装:NO端子面层:Tin/Silver/Copper (Sn/Ag/Cu)
端子形式:THROUGH-HOLE端子位置:SINGLE
处于峰值回流温度下的最长时间:NOT SPECIFIED晶体管应用:SWITCHING
晶体管元件材料:SILICONBase Number Matches:1

IXFR36N50P 数据手册

 浏览型号IXFR36N50P的Datasheet PDF文件第2页浏览型号IXFR36N50P的Datasheet PDF文件第3页浏览型号IXFR36N50P的Datasheet PDF文件第4页浏览型号IXFR36N50P的Datasheet PDF文件第5页 
PolarHVTM HiPerFET  
Power MOSFET  
IXFC 36N50P  
IXFR 36N50P  
VDSS = 500  
ID25 19  
V
A
=
RDS(on) 190 mΩ  
200 ns  
(Electrically Isolated Back Surface)  
trr  
N-Channel Enhancement Mode  
Avalanche Rated  
Fast Intrinsic Diode  
Symbol  
Test Conditions  
Maximum Ratings  
ISOPLUS220TM (IXFC)  
E153432  
VDSS  
VDGR  
TJ = 25° C to 150° C  
500  
500  
V
TJ = 25° C to 150° C; RGS = 1 MΩ  
V
VGSS  
VGSM  
Continuous  
Transient  
30  
40  
V
V
G
D
S
Isolated back surface  
ID25  
IDM  
TC = 25° C  
19  
A
A
TC = 25° C, pulse width limited by TJM  
100  
ISOPLUS247TM (IXFR)  
E153432  
IAR  
TC =25° C  
TC =25° C  
TC =25° C  
36  
50  
A
mJ  
J
EAR  
EAS  
1.5  
dv/dt  
PD  
IS IDM, di/dt 100 A/µs, VDD VDSS  
TJ 150° C, RG = 4 Ω  
,
20  
V/ns  
G
D
Isolated back surface  
TC =25° C  
156  
W
S
TJ  
TJM  
Tstg  
-55 ... +150  
150  
-55 ... +150  
°C  
°C  
°C  
G = Gate  
D = Drain  
S = Source  
TL  
1.6 mm (0.062 in.) from case for 10 s  
50/60 Hz, RMS, 1 minute  
300  
°C  
Features  
l
International standard isolated  
packages  
UL recognized packages  
VISOL  
2500  
V~  
l
FC  
Mounting Force  
(IXFC)  
(IXFR)  
11..65 / 2.5..15  
20..120 / 4.5..25  
N/lb  
N/lb  
l
Silicon chip on Direct-Copper-Bond  
Weight  
(IXFC)  
(IXFR)  
3
5
g
g
substrate  
- High power dissipation  
- Isolated mounting surface  
- 2500V electrical isolation  
Unclamped Inductive Switching (UIS)  
rated  
Low package inductance  
- easy to drive and to protect  
Fast intrinsic diode  
Symbol  
Test Conditions  
Characteristic Values  
l
l
l
(TJ = 25° C unless otherwise specified)  
Min. Typ.  
Max.  
BVDSS  
VGS(th)  
IGSS  
VGS = 0 V, ID = 250 µA  
500  
V
V
VDS = VGS, ID = 4 mA  
2.5  
5.0  
VGS  
=
30 VDC, VDS = 0  
100  
nA  
Advantages  
Easy to mount  
Space savings  
High power density  
l
IDSS  
VDS = VDSS  
VGS = 0 V  
25  
250  
µA  
µA  
l
TJ = 125° C  
l
RDS(on)  
VGS = 10 V, ID = IT  
190 mΩ  
DS99312E(10/05)  
© 2006 IXYS All rights reserved  

IXFR36N50P 替代型号

型号 品牌 替代类型 描述 数据表
IXTH36N50P IXYS

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