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MJD2955_06

更新时间： 2024-11-05 04:15:31
品牌 Logo 应用领域
安森美 - ONSEMI 晶体晶体管
页数 文件大小 规格书
6页 78K
描述
Complementary Power Transistors DPAK For Surface Mount Applications

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MJD2955_06 数据手册

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MJD2955 (PNP)  
MJD3055 (NPN)  
Complementary Power  
Transistors  
DPAK For Surface Mount Applications  
http://onsemi.com  
Designed for general purpose amplifier and low speed switching  
applications.  
SILICON  
POWER TRANSISTORS  
10 AMPERES  
60 VOLTS, 20 WATTS  
Features  
• Lead Formed for Surface Mount Applications in Plastic Sleeves  
(No Suffix)  
• Straight Lead Version in Plastic Sleeves (“−1” Suffix)  
• Electrically Similar to MJE2955 and MJE3055  
• DC Current Gain Specified to 10 Amperes  
MARKING  
DIAGRAMS  
• High Current Gain−Bandwidth Product − f = 2.0 MHz (Min) @ I  
T
C
4
= 500 mAdc  
• Epoxy Meets UL 94 V−0 @ 0.125 in  
• ESD Ratings: Human Body Model, 3B u 8000 V  
Machine Model, C u 400 V  
YWW  
J
xx55G  
2
1
3
DPAK  
CASE 369C  
STYLE 1  
• Pb−Free Packages are Available  
MAXIMUM RATINGS  
4
Rating  
Symbol  
Max  
Unit  
YWW  
J
xx55G  
Collector−Emitter Voltage  
Collector−Base Voltage  
Emitter−Base Voltage  
Collector Current  
V
60  
70  
5
Vdc  
Vdc  
Vdc  
Adc  
Adc  
CEO  
V
CB  
EB  
1
V
2
DPAK−3  
CASE 369D  
STYLE 1  
3
I
C
I
B
10  
6
Base Current  
Total Power Dissipation @ T = 25°C  
P {  
D
20  
0.16  
W
W/°C  
C
Derate above 25°C  
Y
= Year  
Total Power Dissipation (Note1)  
P
W
WW = Work Week  
Jxx55 = Device Code  
x = 29 or 30  
D
1.75  
0.014  
@ T = 25°C  
A
W/°C  
°C  
Derate above 25°C  
G
= Pb−Free Package  
Operating and Storage Junction  
Temperature Range  
T , T  
J
−55 to +150  
stg  
ORDERING INFORMATION  
See detailed ordering and shipping information in the package  
dimensions section on page 2 of this data sheet.  
THERMAL CHARACTERISTICS  
Characteristic  
Symbol  
Max  
6.25  
71.4  
Unit  
°C/W  
°C/W  
Thermal Resistance, Junction−to−Case  
R
q
JC  
Thermal Resistance, Junction−to−Ambient  
(Note1)  
R
q
JA  
Maximum ratings are those values beyond which device damage can occur.  
Maximum ratings applied to the device are individual stress limit values (not  
normal operating conditions) and are not valid simultaneously. If these limits are  
exceeded, device functional operation is not implied, damage may occur and  
reliability may be affected.  
†Safe Area Curves are indicated by Figure 1. Both limits are applicable and must  
be observed.  
1. These ratings are applicable when surface mounted on the minimum pad  
sizes recommended.  
©
Semiconductor Components Industries, LLC, 2006  
1
Publication Order Number:  
January, 2006 − Rev. 8  
MJD2955/D  
 
123456

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