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IXTT11P50 PDF预览

IXTT11P50

更新时间: 2024-11-17 22:11:03
品牌 Logo 应用领域
IXYS /
页数 文件大小 规格书
2页 124K
描述
Standard Power MOSFET P-Channel Enhancement Mode Avalanche Rated

IXTT11P50 数据手册

 浏览型号IXTT11P50的Datasheet PDF文件第2页 
VDSS  
ID25 RDS(on)  
Standard Power MOSFET  
P-ChannelEnhancementMode  
IXTH/IXTT 10P50  
-500 V -10 A 0.90 Ω  
-500 V -11 A 0.75 Ω  
AvalancheRated  
IXTH/IXTT 11P50  
TO-247AD(IXTH)  
Symbol  
TestConditions  
Maximum Ratings  
VDSS  
VDGR  
TJ = 25°C to 150°C  
TJ = 25°C to 150°C; RGS = 1 MΩ  
-500  
-500  
V
V
VGS  
VGSM  
Continuous  
Transient  
±20  
±30  
V
V
(TAB)  
D
ID25  
IDM  
IAR  
TC = 25°C  
10P50  
11P50  
-10  
-11  
A
A
TO-268 (IXTT) Case Style  
TC = 25°C, pulse width limited by TJ  
TC = 25°C  
10P50  
-40  
A
11P50  
-44  
A
10P50  
11P50  
-10  
-11  
A
A
G
(TAB)  
D
EAR  
PD  
TC = 25°C  
TC = 25°C  
30  
mJ  
W
S
D = Drain  
300  
G = Gate  
S = Source  
TAB = Drain  
TJ  
TJM  
Tstg  
-55 ... +150  
150  
-55 ... +150  
°C  
°C  
°C  
TL  
Maximum lead temperature for soldering  
1.6 mm (0.062 in.) from case for 10 s  
300  
°C  
Md  
Mounting torque  
(TO-247)  
1.13/10 Nm/lb.in.  
Features  
Weight  
TO-247AD  
TO-268  
6
4
g
g
z
International standard packages  
Low RDS (on) HDMOSTM process  
Rugged polysilicon gate cell structure  
Unclamped Inductive Switching (UIS)  
rated  
z
z
z
Symbol  
TestConditions  
Characteristic Values  
(TJ = 25°C, unless otherwise specified)  
min. typ. max.  
z
Low package inductance  
- easy to drive and to protect  
VDSS  
VGS = 0 V, I = -250 µA  
-500  
V
BVDSS TempDerature Coefficient  
0.054  
%/K  
Advantages  
z
Easy to mount  
VGS(th)  
VDS = V , ID = -250 µA  
-3.0  
-5.0  
V
VGS(th) TeGmS peratureCoefficient  
-0.122  
%/K  
z
Space savings  
z
High power density  
IGSS  
IDSS  
VGS = ±20 VDC, VDS = 0  
±100  
nA  
VDS = 0.8 • VDSS  
VGS = 0 V  
T = 25°C  
TJJ = 125°C  
-200  
µA  
-1 mA  
RDS(on)  
VGS = -10 V, ID = 0.5 • ID25  
10P50  
11P50  
0.90  
0.75  
RDS(on) TemperatureCoefficient  
0.6 %/K  
94535F (7/02)  
© 2002 IXYS All rights reserved  

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