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IXXH75N60C3D1 PDF预览

IXXH75N60C3D1

更新时间: 2024-11-18 21:16:55
品牌 Logo 应用领域
IXYS
页数 文件大小 规格书
7页 186K
描述
Insulated Gate Bipolar Transistor, 150A I(C), 600V V(BR)CES, N-Channel, TO-247AD, TO-247AD, 3 PIN

IXXH75N60C3D1 技术参数

是否Rohs认证: 符合生命周期:Transferred
零件包装代码:TO-247AD包装说明:FLANGE MOUNT, R-PSFM-T3
针数:3Reach Compliance Code:compliant
风险等级:5.59外壳连接:COLLECTOR
最大集电极电流 (IC):150 A集电极-发射极最大电压:600 V
配置:SINGLE WITH BUILT-IN DIODE门极发射器阈值电压最大值:5.5 V
门极-发射极最大电压:20 VJEDEC-95代码:TO-247AD
JESD-30 代码:R-PSFM-T3元件数量:1
端子数量:3最高工作温度:175 °C
封装主体材料:PLASTIC/EPOXY封装形状:RECTANGULAR
封装形式:FLANGE MOUNT极性/信道类型:N-CHANNEL
最大功率耗散 (Abs):750 W认证状态:Not Qualified
子类别:Insulated Gate BIP Transistors表面贴装:NO
端子形式:THROUGH-HOLE端子位置:SINGLE
晶体管应用:POWER CONTROL晶体管元件材料:SILICON
标称断开时间 (toff):185 ns标称接通时间 (ton):105 ns
Base Number Matches:1

IXXH75N60C3D1 数据手册

 浏览型号IXXH75N60C3D1的Datasheet PDF文件第2页浏览型号IXXH75N60C3D1的Datasheet PDF文件第3页浏览型号IXXH75N60C3D1的Datasheet PDF文件第4页浏览型号IXXH75N60C3D1的Datasheet PDF文件第5页浏览型号IXXH75N60C3D1的Datasheet PDF文件第6页浏览型号IXXH75N60C3D1的Datasheet PDF文件第7页 
XPTTM 600V IGBT  
GenX3TM w/ Diode  
VCES = 600V  
IC110 = 75A  
VCE(sat) 2.3V  
tfi(typ) = 75ns  
IXXH75N60C3D1  
Extreme Light Punch Through  
IGBT for 20-60 kHz Switching  
TO-247 AD  
Symbol  
Test Conditions  
Maximum Ratings  
VCES  
VCGR  
TJ = 25°C to 175°C  
600  
600  
V
V
TJ = 25°C to 175°C, RGE = 1MΩ  
G
VGES  
VGEM  
Continuous  
Transient  
±20  
±30  
V
V
C
Tab  
=
E
IC25  
IC110  
IF110  
TC= 25°C (Chip Capability)  
TC = 110°C  
TC = 110°C  
150  
75  
30  
A
A
A
G = Gate  
E = Emitter  
C
Collector  
Tab = Collector  
ICM  
TC = 25°C, 1ms  
300  
A
IA  
EAS  
TC = 25°C  
TC = 25°C  
30  
A
500  
mJ  
A
Features  
SSOA  
VGE = 15V, TVJ = 150°C, RG = 5Ω  
ICM = 150  
(RBSOA)  
Clamped Inductive Load  
@VCE VCES  
z Optimized for 20-60kHz Switching  
z Square RBSOA  
tsc  
VGE= 15V, VCE = 360V, TJ = 150°C  
10  
μs  
z Anti-Parallel Ultra Fast Diode  
z Avalanche Capability  
(SCSOA)  
RG = 22Ω, Non Repetitive  
PC  
TC = 25°C  
750  
W
z Short Circuit Capability  
z International Standard Package  
TJ  
TJM  
Tstg  
-55 ... +175  
175  
°C  
°C  
°C  
-55 ... +175  
Advantages  
TL  
TSOLD  
Maximum Lead Temperature for Soldering  
1.6 mm (0.062in.) from Case for 10s  
300  
260  
°C  
°C  
z High Power Density  
z 175°C Rated  
z Extremely Rugged  
z Low Gate Drive Requirement  
Md  
Mounting Torque  
1.13/10  
6
Nm/lb.in.  
g
Weight  
Applications  
Symbol  
Test Conditions  
Characteristic Values  
z Power Inverters  
z UPS  
(TJ = 25°C, Unless Otherwise Specified)  
Min.  
600  
3.0  
Typ.  
Max.  
BVCES  
VGE(th)  
ICES  
IC = 250μA, VGE = 0V  
IC = 250μA, VCE = VGE  
VCE = VCES, VGE = 0V  
V
V
z Motor Drives  
z SMPS  
5.5  
z PFC Circuits  
z Battery Chargers  
z Welding Machines  
z Lamp Ballasts  
25 μA  
3 mA  
TJ = 150°C  
TJ = 150°C  
IGES  
VCE = 0V, VGE = ±20V  
±100 nA  
VCE(sat)  
IC = 60A, VGE = 15V, Note 1  
1.85  
2.30  
2.30  
V
V
© 2013 IXYS CORPORATION, All Rights Reserved  
DS100330C(01/13)  

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