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IXFR32N50Q PDF预览

IXFR32N50Q

更新时间: 2024-11-04 22:11:55
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IXYS 晶体晶体管开关脉冲局域网
页数 文件大小 规格书
4页 95K
描述
HiPerFET Power MOSFETs ISOPLUS247

IXFR32N50Q 技术参数

是否无铅: 不含铅是否Rohs认证: 符合
生命周期:Obsolete包装说明:IN-LINE, R-PSIP-T3
针数:3Reach Compliance Code:compliant
风险等级:5.83Is Samacsys:N
其他特性:AVALANCHE RATED雪崩能效等级(Eas):1500 mJ
外壳连接:ISOLATED配置:SINGLE WITH BUILT-IN DIODE
最小漏源击穿电压:500 V最大漏极电流 (Abs) (ID):30 A
最大漏极电流 (ID):30 A最大漏源导通电阻:0.16 Ω
FET 技术:METAL-OXIDE SEMICONDUCTORJESD-30 代码:R-PSIP-T3
JESD-609代码:e1元件数量:1
端子数量:3工作模式:ENHANCEMENT MODE
最高工作温度:150 °C封装主体材料:PLASTIC/EPOXY
封装形状:RECTANGULAR封装形式:IN-LINE
峰值回流温度(摄氏度):NOT SPECIFIED极性/信道类型:N-CHANNEL
最大功率耗散 (Abs):310 W最大脉冲漏极电流 (IDM):120 A
认证状态:Not Qualified子类别:FET General Purpose Power
表面贴装:NO端子面层:Tin/Silver/Copper (Sn/Ag/Cu)
端子形式:THROUGH-HOLE端子位置:SINGLE
处于峰值回流温度下的最长时间:NOT SPECIFIED晶体管应用:SWITCHING
晶体管元件材料:SILICONBase Number Matches:1

IXFR32N50Q 数据手册

 浏览型号IXFR32N50Q的Datasheet PDF文件第2页浏览型号IXFR32N50Q的Datasheet PDF文件第3页浏览型号IXFR32N50Q的Datasheet PDF文件第4页 
HiPerFETTM Power MOSFETs  
ISOPLUS247TM  
VDSS  
ID25  
RDS(on)  
IXFR 30N50Q  
IXFR 32N50Q  
500V  
500V  
trr £ 250 ns  
29 A  
30 A  
0.16 W  
0.15 W  
(Electrically Isolated Back Surface)  
N-Channel Enhancement Mode  
High dV/dt, Low trr, HDMOSTM Family  
Preliminary data  
ISOPLUS 247TM  
E153432  
Symbol  
TestConditions  
MaximumRatings  
VDSS  
VDGR  
TJ = 25°C to 150°C  
TJ = 25°C to 150°C; RGS = 1 MW  
500  
500  
V
V
VGS  
VGSM  
Continuous  
Transient  
±20  
±30  
V
V
G
D
ID25  
IDM  
IAR  
TC = 25°C  
30N50  
32N50  
30N50  
32N50  
30N50  
32N50  
30  
120  
30  
A
A
A
Isolated back surface*  
D = Drain  
TC = 25°C, Pulse width limited by TJM  
TC = 25°C  
G = Gate  
S = Source  
*Patentpending  
EAS  
EAR  
TC = 25°C  
TC = 25°C  
1.5  
45  
J
mJ  
Features  
dv/dt  
IS £ IDM, di/dt £ 100 A/ms, VDD £ VDSS  
TJ £ 150°C, RG = 2 W  
5
V/ns  
• SiliconchiponDirect-Copper-Bond  
substrate  
- High power dissipation  
PD  
TC = 25°C  
310  
W
- Isolated mounting surface  
- 2500V electricalisolation  
• Low drain to tab capacitance(<50pF)  
• Low RDS (on) HDMOSTM process  
• Rugged polysilicon gate cell structure  
• Unclamped Inductive Switching (UIS)  
rated  
TJ  
TJM  
Tstg  
-55 ... +150  
150  
-55 ... +150  
°C  
°C  
°C  
TL  
1.6 mm (0.062 in.) from case for 10 s  
300  
2500  
6
°C  
V~  
g
VISOL  
Weight  
50/60 Hz, RMS  
t = 1 minute leads-to-tab  
• Fast intrinsic Rectifier  
Applications  
Symbol  
TestConditions  
CharacteristicValues  
(TJ = 25°C, unless otherwise specified)  
DC-DC converters  
• Battery chargers  
min. typ. max.  
• Switched-modeandresonant-mode  
powersupplies  
• DC choppers  
VDSS  
VGS(th)  
IGSS  
VGS = 0 V, ID = 1mA  
VDS = VGS, ID = 4mA  
VGS = ±20 VDC, VDS = 0  
500  
2
V
V
4
• AC motor control  
±100  
nA  
IDSS  
VDS = VDSS  
VGS = 0 V  
TJ = 25°C  
TJ = 125°C  
100  
1
mA  
mA  
Advantages  
• Easy assembly  
• Space savings  
• High power density  
RDS(on)  
VGS = 10 V, ID = IT  
Notes 1, 2  
30N50  
32N50  
0.16  
0.15  
W
W
IXYS reserves the right to change limits, test conditions, and dimensions.  
© 2000 IXYS All rights reserved  
98608B(7/00)  
1 - 4  

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