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IRFB3307ZPBF PDF预览

IRFB3307ZPBF

更新时间: 2024-11-21 03:56:55
品牌 Logo 应用领域
英飞凌 - INFINEON /
页数 文件大小 规格书
11页 836K
描述
HEXFET Power MOSFET

IRFB3307ZPBF 技术参数

是否Rohs认证: 符合生命周期:Active
包装说明:LEAD FREE PACKAGE-3Reach Compliance Code:compliant
ECCN代码:EAR99Factory Lead Time:15 weeks
风险等级:1.07雪崩能效等级(Eas):140 mJ
外壳连接:DRAIN配置:SINGLE WITH BUILT-IN DIODE
最小漏源击穿电压:75 V最大漏极电流 (Abs) (ID):120 A
最大漏极电流 (ID):120 A最大漏源导通电阻:0.0058 Ω
FET 技术:METAL-OXIDE SEMICONDUCTORJEDEC-95代码:TO-220AB
JESD-30 代码:R-PSFM-T3元件数量:1
端子数量:3工作模式:ENHANCEMENT MODE
最高工作温度:175 °C封装主体材料:PLASTIC/EPOXY
封装形状:RECTANGULAR封装形式:FLANGE MOUNT
峰值回流温度(摄氏度):NOT SPECIFIED极性/信道类型:N-CHANNEL
最大功率耗散 (Abs):230 W最大脉冲漏极电流 (IDM):480 A
认证状态:Not Qualified子类别:FET General Purpose Power
表面贴装:NO端子形式:THROUGH-HOLE
端子位置:SINGLE处于峰值回流温度下的最长时间:NOT SPECIFIED
晶体管应用:SWITCHING晶体管元件材料:SILICON
Base Number Matches:1

IRFB3307ZPBF 数据手册

 浏览型号IRFB3307ZPBF的Datasheet PDF文件第2页浏览型号IRFB3307ZPBF的Datasheet PDF文件第3页浏览型号IRFB3307ZPBF的Datasheet PDF文件第4页浏览型号IRFB3307ZPBF的Datasheet PDF文件第5页浏览型号IRFB3307ZPBF的Datasheet PDF文件第6页浏览型号IRFB3307ZPBF的Datasheet PDF文件第7页 
PD - 97214B  
IRFB3307ZPbF  
IRFS3307ZPbF  
IRFSL3307ZPbF  
Applications  
l High Efficiency Synchronous Rectification in  
SMPS  
HEXFET® Power MOSFET  
l Uninterruptible Power Supply  
l High Speed Power Switching  
l Hard Switched and High Frequency Circuits  
D
S
VDSS  
RDS(on) typ.  
max.  
ID (Silicon Limited)  
ID (Package Limited)  
75V  
4.6m  
5.8m  
120A  
:
:
c
G
Benefits  
75A  
l Improved Gate, Avalanche and Dynamic  
dv/dt Ruggedness  
l Fully Characterized Capacitance and  
Avalanche SOA  
D
D
D
l Enhanced body diode dV/dt and dI/dt  
Capability  
S
S
D
S
D
G
G
G
D2Pak  
TO-262  
TO-220AB  
IRFB3307ZPbF  
IRFS3307ZPbF  
IRFSL3307ZPbF  
G
D
S
Gate  
Drain  
Source  
Absolute Maximum Ratings  
Symbol  
Parameter  
Max.  
120c  
88c  
Units  
ID @ TC = 25°C  
Continuous Drain Current, VGS @ 10V (Silicon Limited)  
Continuous Drain Current, VGS @ 10V (Silicon Limited)  
Continuous Drain Current, VGS @ 10V (Package Limited)  
Pulsed Drain Current d  
ID @ TC = 100°C  
ID @ TC = 25°C  
IDM  
A
75  
480  
PD @TC = 25°C  
230  
W
Maximum Power Dissipation  
1.5  
Linear Derating Factor  
W/°C  
V
VGS  
± 20  
Gate-to-Source Voltage  
6.7  
Peak Diode Recovery f  
dv/dt  
TJ  
V/ns  
°C  
-55 to + 175  
Operating Junction and  
TSTG  
Storage Temperature Range  
300  
Soldering Temperature, for 10 seconds  
(1.6mm from case)  
10lbxin (1.1Nxm)  
Mounting torque, 6-32 or M3 screw  
Avalanche Characteristics  
Single Pulse Avalanche Energy e  
EAS (Thermally limited)  
140  
75  
mJ  
A
Avalanche Currentꢀc  
IAR  
Repetitive Avalanche Energy g  
EAR  
23  
mJ  
Thermal Resistance  
Symbol  
Parameter  
Typ.  
–––  
Max.  
0.65  
–––  
62  
Units  
RθJC  
Junction-to-Case k  
RθCS  
RθJA  
RθJA  
0.50  
–––  
–––  
°C/W  
Case-to-Sink, Flat Greased Surface , TO-220  
Junction-to-Ambient, TO-220 k  
Junction-to-Ambient (PCB Mount) , D2Pak jk  
40  
www.irf.com  
1
05/31/07  

IRFB3307ZPBF 替代型号

型号 品牌 替代类型 描述 数据表
IRF2807ZPBF INFINEON

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