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IRFB4127 PDF预览

IRFB4127

更新时间: 2024-11-22 11:14:07
品牌 Logo 应用领域
英飞凌 - INFINEON /
页数 文件大小 规格书
9页 299K
描述
The StrongIRFET™ power MOSFET family is optimized for low RDS(on) and high current capability. The devices are ideal for low frequency applications requiring performance and ruggedness. The comprehensive portfolio addresses a broad range of applications including DC motors, battery management systems, inverters, and DC-DC converters. 

IRFB4127 数据手册

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PD -97136A  
IRFB4127PbF  
HEXFET® Power MOSFET  
Applications  
D
VDSS  
200V  
l High Efficiency Synchronous Rectification in SMPS  
RDS(on) typ.  
l Uninterruptible Power Supply  
l High Speed Power Switching  
l Hard Switched and High Frequency Circuits  
17m  
20m  
:
:
G
max.  
ID  
76A  
S
Benefits  
l Improved Gate, Avalanche and Dynamic dV/dt  
Ruggedness  
l Fully Characterized Capacitance and Avalanche  
SOA  
S
l Enhanced body diode dV/dt and dI/dt Capability  
l Lead-Free  
D
G
TO-220AB  
G
D
S
Gate  
Drain  
Source  
Absolute Maximum Ratings  
Symbol  
ID @ TC = 25°C  
ID @ TC = 100°C  
IDM  
Parameter  
Continuous Drain Current, VGS @ 10V  
Continuous Drain Current, VGS @ 10V  
Pulsed Drain Current c  
Max.  
76  
Units  
54  
A
300  
375  
2.5  
PD @TC = 25°C  
Maximum Power Dissipation  
Linear Derating Factor  
W
W/°C  
V
VGS  
± 20  
57  
Gate-to-Source Voltage  
Peak Diode Recovery e  
dv/dt  
TJ  
V/ns  
°C  
-55 to + 175  
Operating Junction and  
TSTG  
Storage Temperature Range  
Soldering Temperature, for 10 seconds  
(1.6mm from case)  
300  
10lbxin (1.1Nxm)  
Mounting torque, 6-32 or M3 screw  
Avalanche Characteristics  
Single Pulse Avalanche Energy d  
EAS (Thermally limited)  
250  
mJ  
A
Avalanche Current c  
IAR  
See Fig. 14, 15, 22a, 22b,  
Repetitive Avalanche Energy f  
EAR  
mJ  
Thermal Resistance  
Symbol  
Parameter  
Typ.  
–––  
Max.  
0.4  
Units  
RθJC  
RθCS  
RθJA  
Junction-to-Case j  
Case-to-Sink, Flat Greased Surface  
0.50  
–––  
–––  
62  
°C/W  
Junction-to-Ambient ij  
www.irf.com  
1
8/28/08  

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