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IRFB4110PBF PDF预览

IRFB4110PBF

更新时间: 2024-02-29 15:55:18
品牌 Logo 应用领域
飞思卡尔 - FREESCALE /
页数 文件大小 规格书
8页 662K
描述
HEXFETPower MOSFET

IRFB4110PBF 技术参数

是否无铅: 不含铅是否Rohs认证: 符合
生命周期:Transferred零件包装代码:TO-220AB
包装说明:HALOGEN AND LEAD FREE, PLASTIC PACKAGE-3针数:3
Reach Compliance Code:unknownECCN代码:EAR99
风险等级:7.73雪崩能效等级(Eas):190 mJ
外壳连接:DRAIN配置:SINGLE WITH BUILT-IN DIODE
最小漏源击穿电压:100 V最大漏极电流 (Abs) (ID):180 A
最大漏极电流 (ID):120 A最大漏源导通电阻:0.0045 Ω
FET 技术:METAL-OXIDE SEMICONDUCTORJEDEC-95代码:TO-220AB
JESD-30 代码:R-PSFM-T3JESD-609代码:e3
元件数量:1端子数量:3
工作模式:ENHANCEMENT MODE最高工作温度:175 °C
封装主体材料:PLASTIC/EPOXY封装形状:RECTANGULAR
封装形式:FLANGE MOUNT峰值回流温度(摄氏度):250
极性/信道类型:N-CHANNEL最大功率耗散 (Abs):370 W
最大脉冲漏极电流 (IDM):670 A认证状态:Not Qualified
子类别:FET General Purpose Power表面贴装:NO
端子面层:Matte Tin (Sn) - with Nickel (Ni) barrier端子形式:THROUGH-HOLE
端子位置:SINGLE处于峰值回流温度下的最长时间:30
晶体管应用:SWITCHING晶体管元件材料:SILICON
Base Number Matches:1

IRFB4110PBF 数据手册

 浏览型号IRFB4110PBF的Datasheet PDF文件第2页浏览型号IRFB4110PBF的Datasheet PDF文件第3页浏览型号IRFB4110PBF的Datasheet PDF文件第4页浏览型号IRFB4110PBF的Datasheet PDF文件第5页浏览型号IRFB4110PBF的Datasheet PDF文件第6页浏览型号IRFB4110PBF的Datasheet PDF文件第7页 
IRFB4110PBF  
Applications  
l High Efficiency Synchronous Rectification in SMPS  
HEXFET® Power MOSFET  
VDSS  
RDS(on) typ.  
max.  
ID (Silicon Limited)  
ID (Package Limited)  
100V  
l Uninterruptible Power Supply  
l High Speed Power Switching  
l Hard Switched and High Frequency Circuits  
3.7m  
4.5m  
180A  
120A  
Benefits  
l Improved Gate, Avalanche and Dynamic dv/dt  
Ruggedness  
D
S
D
l Fully Characterized Capacitance and Avalanche  
SOA  
l Enhanced body diode dV/dt and dI/dt Capability  
G
S
D
G
TO-220AB  
G
D
S
Gate  
Drain  
Source  
Absolute Maximum Ratings  
Symbol  
Parameter  
Max.  
180  
130  
120  
670  
370  
2.5  
Units  
A
ID @ TC = 25°C  
Continuous Drain Current, VGS @ 10V (Silicon Limited)  
Continuous Drain Current, VGS @ 10V (Silicon Limited)  
Continuous Drain Current, VGS @ 10V (Wire Bond Limited)  
Pulsed Drain Current  
ID @ TC = 100°C  
ID @ TC = 25°C  
IDM  
PD @TC = 25°C  
W
Maximum Power Dissipation  
Linear Derating Factor  
W/°C  
V
VGS  
± 20  
5.3  
Gate-to-Source Voltage  
Peak Diode Recovery  
dv/dt  
TJ  
V/ns  
°C  
-55 to + 175  
Operating Junction and  
TSTG  
Storage Temperature Range  
300  
Soldering Temperature, for 10 seconds  
(1.6mm from case)  
10lb in (1.1N m)  
Mounting torque, 6-32 or M3 screw  
Avalanche Characteristics  
Single Pulse Avalanche Energy  
EAS (Thermally limited)  
190  
mJ  
A
Avalanche Current  
IAR  
See Fig. 14, 15, 22a, 22b  
Repetitive Avalanche Energy  
EAR  
mJ  
Thermal Resistance  
Symbol  
Parameter  
Typ.  
–––  
Max.  
0.402  
–––  
Units  
Rθ  
JC  
Junction-to-Case  
RθCS  
0.50  
–––  
°C/W  
Case-to-Sink, Flat Greased Surface  
Junction-to-Ambient  
Rθ  
JA  
62  
www.freescale.net.cn  
1 / 8  

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