PD - 97227
IRFB4228PbF
PDP SWITCH
Features
Key Parameters
l
Advanced Process Technology
VDS min
150
180
12
170
175
V
V
m:
A
°C
l
Key Parameters Optimized for PDP Sustain,
Energy Recovery and Pass Switch Applications
Low EPULSE Rating to Reduce Power
Dissipation in PDP Sustain, Energy Recovery
and Pass Switch Applications
VDS (Avalanche) typ.
DS(ON) typ. @ 10V
RP max @ TC= 100°C
R
I
l
TJ max
l
l
Low QG for Fast Response
High Repetitive Peak Current Capability for
Reliable Operation
D
D
l
Short Fall & Rise Times for Fast Switching
175°C Operating Junction Temperature for
Improved Ruggedness
l
G
S
l
Repetitive Avalanche Capability for Robustness
and Reliability
D
G
S
TO-220AB
G
D
S
Gate
Drain
Source
Description
This HEXFET® Power MOSFET is specifically designed for Sustain; Energy Recovery & Pass switch
applicationsinPlasmaDisplayPanels. ThisMOSFETutilizesthelatestprocessingtechniquestoachieve
low on-resistance per silicon area and low EPULSE rating. Additional features of this MOSFET are 175°C
operating junction temperature and high repetitive peak current capability. These features combine to
make this MOSFET a highly efficient, robust and reliable device for PDP driving applications.
Absolute Maximum Ratings
Max.
±30
Parameter
Units
V
VGS
Gate-to-Source Voltage
ID @ TC = 25°C
ID @ TC = 100°C
IDM
Continuous Drain Current, VGS @ 10V
Continuous Drain Current, VGS @ 10V
Pulsed Drain Current c
83
A
59
330
IRP @ TC = 100°C
PD @TC = 25°C
PD @TC = 100°C
170
Repetitive Peak Current g
Power Dissipation
330
W
170
Power Dissipation
2.2
Linear Derating Factor
W/°C
°C
TJ
-40 to + 175
Operating Junction and
TSTG
Storage Temperature Range
Soldering Temperature for 10 seconds
Mounting Torque, 6-32 or M3 Screw
300
10lbxin (1.1Nxm)
N
Thermal Resistance
Parameter
Typ.
Max.
0.45
–––
62
Units
Junction-to-Case f
RθJC
RθCS
RθJA
–––
0.50
–––
Case-to-Sink, Flat, Greased Surface
Junction-to-Ambient f
°C/W
Notes through ꢀare on page 8
www.irf.com
1
06/26/06