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IRFB4228PBF PDF预览

IRFB4228PBF

更新时间: 2024-09-25 04:23:19
品牌 Logo 应用领域
英飞凌 - INFINEON 晶体开关晶体管功率场效应晶体管脉冲光电二极管局域网
页数 文件大小 规格书
8页 680K
描述
PDP SWITCH

IRFB4228PBF 数据手册

 浏览型号IRFB4228PBF的Datasheet PDF文件第2页浏览型号IRFB4228PBF的Datasheet PDF文件第3页浏览型号IRFB4228PBF的Datasheet PDF文件第4页浏览型号IRFB4228PBF的Datasheet PDF文件第5页浏览型号IRFB4228PBF的Datasheet PDF文件第6页浏览型号IRFB4228PBF的Datasheet PDF文件第7页 
PD - 97227  
IRFB4228PbF  
PDP SWITCH  
Features  
Key Parameters  
l
Advanced Process Technology  
VDS min  
150  
180  
12  
170  
175  
V
V
m:  
A
°C  
l
Key Parameters Optimized for PDP Sustain,  
Energy Recovery and Pass Switch Applications  
Low EPULSE Rating to Reduce Power  
Dissipation in PDP Sustain, Energy Recovery  
and Pass Switch Applications  
VDS (Avalanche) typ.  
DS(ON) typ. @ 10V  
RP max @ TC= 100°C  
R
I
l
TJ max  
l
l
Low QG for Fast Response  
High Repetitive Peak Current Capability for  
Reliable Operation  
D
D
l
Short Fall & Rise Times for Fast Switching  
175°C Operating Junction Temperature for  
Improved Ruggedness  
l
G
S
l
Repetitive Avalanche Capability for Robustness  
and Reliability  
D
G
S
TO-220AB  
G
D
S
Gate  
Drain  
Source  
Description  
This HEXFET® Power MOSFET is specifically designed for Sustain; Energy Recovery & Pass switch  
applicationsinPlasmaDisplayPanels. ThisMOSFETutilizesthelatestprocessingtechniquestoachieve  
low on-resistance per silicon area and low EPULSE rating. Additional features of this MOSFET are 175°C  
operating junction temperature and high repetitive peak current capability. These features combine to  
make this MOSFET a highly efficient, robust and reliable device for PDP driving applications.  
Absolute Maximum Ratings  
Max.  
±30  
Parameter  
Units  
V
VGS  
Gate-to-Source Voltage  
ID @ TC = 25°C  
ID @ TC = 100°C  
IDM  
Continuous Drain Current, VGS @ 10V  
Continuous Drain Current, VGS @ 10V  
Pulsed Drain Current c  
83  
A
59  
330  
IRP @ TC = 100°C  
PD @TC = 25°C  
PD @TC = 100°C  
170  
Repetitive Peak Current g  
Power Dissipation  
330  
W
170  
Power Dissipation  
2.2  
Linear Derating Factor  
W/°C  
°C  
TJ  
-40 to + 175  
Operating Junction and  
TSTG  
Storage Temperature Range  
Soldering Temperature for 10 seconds  
Mounting Torque, 6-32 or M3 Screw  
300  
10lbxin (1.1Nxm)  
N
Thermal Resistance  
Parameter  
Typ.  
Max.  
0.45  
–––  
62  
Units  
Junction-to-Case f  
RθJC  
RθCS  
RθJA  
–––  
0.50  
–––  
Case-to-Sink, Flat, Greased Surface  
Junction-to-Ambient f  
°C/W  
Notes  through are on page 8  
www.irf.com  
1
06/26/06  

IRFB4228PBF 替代型号

型号 品牌 替代类型 描述 数据表
IRFB4227PBF INFINEON

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