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IRF7402 PDF预览

IRF7402

更新时间: 2024-11-18 21:53:39
品牌 Logo 应用领域
英飞凌 - INFINEON 晶体晶体管开关脉冲光电二极管
页数 文件大小 规格书
8页 136K
描述
HEXFET Power MOSFET

IRF7402 数据手册

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PD - 93851A  
IRF7402  
HEXFET® Power MOSFET  
l Generation V Technology  
l Ultra Low On-Resistance  
l N-Channel MOSFET  
l Very Small SOIC Package  
l Low Profile (<1.1mm)  
l Available in Tape & Reel  
l Fast Switching  
A
A
D
1
2
8
S
S
VDSS = 20V  
7
D
3
4
6
5
S
D
G
D
RDS(on) = 0.035Ω  
Top V iew  
Description  
Fifth Generation HEXFET® power MOSFETs from  
International Rectifier utilize advanced processing  
techniques to achieve extremely low on-resistance per  
siliconarea.Thisbenefit,combinedwiththefastswitching  
speed and ruggedized device design that HEXFET  
power MOSFETs are well known for, provides the  
designer with an extremely efficient and reliable device  
for use in a wide variety of applications.  
The SO-8 has been modified through a customized  
leadframe for enhanced thermal characterstics and  
multiple-die capability making it ideal in a variety of  
power applications. With these improvements, multiple  
devices can be used in an application with dramatically  
reduced board space. The package is designed for  
vapor phase, infrared or wave soldering techniques.  
Power dissipation of greater than 0.8 W is possible in a  
typical PCB mount application.  
SO-8  
Absolute Maximum Ratings  
Parameter  
Max.  
6.8  
Units  
A
ID @ TA = 25°C  
ID @ TA = 70°C  
IDM  
Continuous Drain Current, VGS @ 4.5V  
Continuous Drain Current, VGS @ 4.5V  
Pulsed Drain Current   
5.4  
54  
PD @TA = 25°C  
PD @TA = 70°C  
Power Dissipation  
2.5  
W
Power Dissipation  
1.6  
Linear Derating Factor  
0.02  
W/°C  
V
VGS  
Gate-to-Source Voltage  
± 12  
dv/dt  
Peak Diode Recovery dv/dt ‚  
Junction and Storage Temperature Range  
5.0  
V/ns  
°C  
TJ, TSTG  
-55 to + 150  
Thermal Resistance  
Parameter  
Maximum Junction-to-Ambient „  
Max.  
50  
Units  
°C/W  
RθJA  
www.irf.com  
1
2/22/00  

IRF7402 替代型号

型号 品牌 替代类型 描述 数据表
IRF7402TRPBF INFINEON

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