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IRF7403_04 PDF预览

IRF7403_04

更新时间: 2024-11-19 04:44:35
品牌 Logo 应用领域
英飞凌 - INFINEON /
页数 文件大小 规格书
9页 231K
描述
HEXFET Power MOSFET

IRF7403_04 数据手册

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PD - 95301  
IRF7403PbF  
HEXFET® Power MOSFET  
l Generation V Technology  
l Ultra Low On-Resistance  
l N-ChannelMosfet  
l Surface Mount  
l Available in Tape & Reel  
l Dynamic dv/dt Rating  
l Fast Switching  
A
A
D
1
2
3
4
8
7
S
S
S
G
VDSS = 30V  
D
6
5
D
D
R
DS(on) = 0.022Ω  
l Lead-Free  
Top View  
Description  
Fifth GenerationHEXFETsfromInternationalRectifierutilizeadvancedprocessing  
techniques to achieve the lowest possible on-resistance per silicon area. This  
benefit, combinedwiththefastswitchingspeedandruggedizeddevicedesignthat  
HEXFET Power MOSFETs are well known for, provides the designer with an  
extremely efficient device for use in a wide variety of applications.  
The SO-8 has been modified through a customized leadframe for enhanced  
thermal characteristics and multiple-die capability making it ideal in a variety of  
power applications. With these improvements, multiple devices can be used in  
an application with dramatically reduced board space. The package is designed  
for vapor phase, infra red, or wave soldering techniques. Power dissipation of  
greater than 0.8W is possible in a typical PCB mount application.  
SO-8  
Absolute Maximum Ratings  
Parameter  
10 Sec. Pulsed Drain Current, VGS  
Continuous Drain Current, VGS  
Continuous Drain Current, VGS  
Pulsed Drain Current   
Max.  
Units  
10V9.7  
ID @ TA = 25°C  
ID @ TA = 25°C  
ID @ TA = 70°C  
IDM  
@
@
@
10V8.5  
A
10V5.4  
34  
2.5  
P
D @TA = 25°C  
Power Dissipation  
W
W/°C  
V
Linear Derating Factor  
0.02  
±20  
5.0  
VGS  
Gate-to-Source Voltage  
dv/dt  
TJ, TSTG  
Peak Diode Recovery dv/dt ‚  
Junction and Storage Temperature Range  
V/ns  
°C  
-55 to + 150  
Thermal Resistance Ratings  
Parameter  
Typ.  
Max.  
Units  
RθJA  
Maximum Junction-to-Ambient„  
–––  
50  
°C/W  
9/30/04  

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