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IRF7404PBF PDF预览

IRF7404PBF

更新时间: 2024-11-19 03:58:07
品牌 Logo 应用领域
英飞凌 - INFINEON 晶体晶体管功率场效应晶体管开关脉冲光电二极管PC
页数 文件大小 规格书
9页 232K
描述
HEXFET Power MOSFET

IRF7404PBF 技术参数

是否Rohs认证: 符合生命周期:Obsolete
包装说明:LEAD FREE, SO-8Reach Compliance Code:compliant
ECCN代码:EAR99Factory Lead Time:1 week
风险等级:6.89Samacsys Confidence:3
Samacsys Status:ReleasedSamacsys PartID:610199
Samacsys Pin Count:8Samacsys Part Category:Integrated Circuit
Samacsys Package Category:Small Outline PackagesSamacsys Footprint Name:IRF7404PBF
Samacsys Released Date:2019-04-08 09:38:04Is Samacsys:N
其他特性:LOGIC LEVEL COMPATIBLE配置:SINGLE WITH BUILT-IN DIODE
最小漏源击穿电压:20 V最大漏极电流 (Abs) (ID):5.3 A
最大漏极电流 (ID):6.7 A最大漏源导通电阻:0.04 Ω
FET 技术:METAL-OXIDE SEMICONDUCTORJEDEC-95代码:MS-012AA
JESD-30 代码:R-PDSO-G8JESD-609代码:e3
湿度敏感等级:1元件数量:1
端子数量:8工作模式:ENHANCEMENT MODE
最高工作温度:150 °C最低工作温度:-55 °C
封装主体材料:PLASTIC/EPOXY封装形状:RECTANGULAR
封装形式:SMALL OUTLINE峰值回流温度(摄氏度):NOT SPECIFIED
极性/信道类型:P-CHANNEL最大功率耗散 (Abs):1.6 W
最大脉冲漏极电流 (IDM):27 A认证状态:Not Qualified
子类别:Other Transistors表面贴装:YES
端子面层:Matte Tin (Sn)端子形式:GULL WING
端子位置:DUAL处于峰值回流温度下的最长时间:NOT SPECIFIED
晶体管应用:SWITCHING晶体管元件材料:SILICON
Base Number Matches:1

IRF7404PBF 数据手册

 浏览型号IRF7404PBF的Datasheet PDF文件第2页浏览型号IRF7404PBF的Datasheet PDF文件第3页浏览型号IRF7404PBF的Datasheet PDF文件第4页浏览型号IRF7404PBF的Datasheet PDF文件第5页浏览型号IRF7404PBF的Datasheet PDF文件第6页浏览型号IRF7404PBF的Datasheet PDF文件第7页 
PD - 95203  
IRF7404PbF  
HEXFET® Power MOSFET  
l Generation V Technology  
l Ultra Low On-Resistance  
l P-Channel Mosfet  
l Surface Mount  
A
D
1
2
3
4
8
S
S
VDSS = -20V  
7
D
6
S
G
D
l Available in Tape & Reel  
l Dynamic dv/dt Rating  
l Fast Switching  
5
D
RDS(on) = 0.040Ω  
Top View  
l Lead-Free  
Description  
FifthGenerationHEXFETsfromInternationalRectifier  
utilize advanced processing techniques to achieve the  
lowest possible on-resistance per silicon area. This  
benefit, combined with the fast switching speed and  
ruggedized device design that HEXFET Power  
MOSFETs are well known for, provides the designer  
with an extremely efficient device for use in a wide  
variety of applications.  
The SO-8 has been modified through a customized  
leadframe for enhanced thermal characteristics and  
multiple-die capability making it ideal in a variety of  
powerapplications. Withtheseimprovements,multiple  
devicescanbeusedinanapplicationwithdramatically  
reduced board space. The package is designed for  
vapor phase, infra red, or wave soldering techniques.  
Power dissipation of greater than 0.8W is possible in  
a typical PCB mount application.  
SO-8  
Absolute Maximum Ratings  
Parameter  
10 Sec. Pulsed Drain Current, VGS @ -4.5V  
Max.  
-7.7  
Units  
ID @ TA = 25°C  
ID @ TA = 25°C  
ID @ TA = 70°C  
IDM  
Continuous Drain Current, VGS @ -4.5V  
Continuous Drain Current, VGS @ -4.5V  
Pulsed Drain Current   
-6.7  
A
-5.4  
-27  
PD @TA = 25°C  
Power Dissipation  
2.5  
W
W/°C  
V
Linear Derating Factor  
0.02  
VGS  
Gate-to-Source Voltage  
± 12  
dv/dt  
TJ,TSTG  
Peak Diode Recovery dv/dt ‚  
Junction and Storage Temperature Range  
-5.0  
V/ns  
°C  
-55 to + 150  
Thermal Resistance Ratings  
Parameter  
Typ.  
Max.  
Units  
RθJA  
Maximum Junction-to-Ambient„  
–––  
50  
°C/W  
www.irf.com  
1
9/30/04  

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