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IRF7404TRPBF PDF预览

IRF7404TRPBF

更新时间: 2024-11-20 12:28:11
品牌 Logo 应用领域
英飞凌 - INFINEON 晶体晶体管功率场效应晶体管光电二极管PC
页数 文件大小 规格书
10页 237K
描述
generation v technology

IRF7404TRPBF 技术参数

是否Rohs认证: 符合生命周期:Active
Reach Compliance Code:compliantECCN代码:EAR99
Factory Lead Time:15 weeks风险等级:0.66
Samacsys Confidence:3Samacsys Status:Released
Samacsys PartID:610193Samacsys Pin Count:8
Samacsys Part Category:Integrated CircuitSamacsys Package Category:Small Outline Packages
Samacsys Footprint Name:SO-8-ASamacsys Released Date:2019-11-02 10:53:25
Is Samacsys:N其他特性:LOGIC LEVEL COMPATIBLE
配置:SINGLE WITH BUILT-IN DIODE最小漏源击穿电压:20 V
最大漏极电流 (Abs) (ID):6.7 A最大漏极电流 (ID):5.3 A
最大漏源导通电阻:0.04 ΩFET 技术:METAL-OXIDE SEMICONDUCTOR
JEDEC-95代码:MS-012AAJESD-30 代码:R-PDSO-G8
JESD-609代码:e3湿度敏感等级:1
元件数量:1端子数量:8
工作模式:ENHANCEMENT MODE最高工作温度:150 °C
封装主体材料:PLASTIC/EPOXY封装形状:RECTANGULAR
封装形式:SMALL OUTLINE峰值回流温度(摄氏度):260
极性/信道类型:P-CHANNEL最大功率耗散 (Abs):2.5 W
认证状态:Not Qualified子类别:Other Transistors
表面贴装:YES端子面层:Matte Tin (Sn)
端子形式:GULL WING端子位置:DUAL
处于峰值回流温度下的最长时间:30晶体管元件材料:SILICON
Base Number Matches:1

IRF7404TRPBF 数据手册

 浏览型号IRF7404TRPBF的Datasheet PDF文件第2页浏览型号IRF7404TRPBF的Datasheet PDF文件第3页浏览型号IRF7404TRPBF的Datasheet PDF文件第4页浏览型号IRF7404TRPBF的Datasheet PDF文件第5页浏览型号IRF7404TRPBF的Datasheet PDF文件第6页浏览型号IRF7404TRPBF的Datasheet PDF文件第7页 
PD - 95203  
IRF7404PbF  
HEXFET® Power MOSFET  
l Generation V Technology  
l Ultra Low On-Resistance  
l P-Channel Mosfet  
l Surface Mount  
A
D
1
2
3
4
8
S
S
VDSS = -20V  
7
D
6
S
G
D
l Available in Tape & Reel  
l Dynamic dv/dt Rating  
l Fast Switching  
5
D
RDS(on) = 0.040Ω  
Top View  
l Lead-Free  
Description  
FifthGenerationHEXFETsfromInternationalRectifier  
utilize advanced processing techniques to achieve the  
lowest possible on-resistance per silicon area. This  
benefit, combined with the fast switching speed and  
ruggedized device design that HEXFET Power  
MOSFETs are well known for, provides the designer  
with an extremely efficient device for use in a wide  
variety of applications.  
The SO-8 has been modified through a customized  
leadframe for enhanced thermal characteristics and  
multiple-die capability making it ideal in a variety of  
powerapplications. Withtheseimprovements,multiple  
devicescanbeusedinanapplicationwithdramatically  
reduced board space. The package is designed for  
vapor phase, infra red, or wave soldering techniques.  
Power dissipation of greater than 0.8W is possible in  
a typical PCB mount application.  
SO-8  
Absolute Maximum Ratings  
Parameter  
10 Sec. Pulsed Drain Current, VGS @ -4.5V  
Max.  
-7.7  
Units  
ID @ TA = 25°C  
ID @ TA = 25°C  
ID @ TA = 70°C  
IDM  
Continuous Drain Current, VGS @ -4.5V  
Continuous Drain Current, VGS @ -4.5V  
Pulsed Drain Current   
-6.7  
A
-5.4  
-27  
PD @TA = 25°C  
Power Dissipation  
2.5  
W
W/°C  
V
Linear Derating Factor  
0.02  
VGS  
Gate-to-Source Voltage  
± 12  
dv/dt  
TJ,TSTG  
Peak Diode Recovery dv/dt ‚  
Junction and Storage Temperature Range  
-5.0  
V/ns  
°C  
-55 to + 150  
Thermal Resistance Ratings  
Parameter  
Typ.  
Max.  
Units  
RθJA  
Maximum Junction-to-Ambient„  
–––  
50  
°C/W  
www.irf.com  
1
9/30/04  

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