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IRF7416TRPBF PDF预览

IRF7416TRPBF

更新时间: 2024-11-19 12:01:15
品牌 Logo 应用领域
英飞凌 - INFINEON 晶体晶体管功率场效应晶体管开关脉冲光电二极管
页数 文件大小 规格书
10页 231K
描述
HEXFET® Power MOSFET

IRF7416TRPBF 技术参数

是否Rohs认证: 符合生命周期:Active
包装说明:SMALL OUTLINE, R-PDSO-G8Reach Compliance Code:compliant
ECCN代码:EAR99HTS代码:8541.29.00.95
风险等级:0.67其他特性:ULTRA LOW RESISTANCE
雪崩能效等级(Eas):370 mJ配置:SINGLE WITH BUILT-IN DIODE
最小漏源击穿电压:30 V最大漏极电流 (ID):10 A
最大漏源导通电阻:0.02 ΩFET 技术:METAL-OXIDE SEMICONDUCTOR
JEDEC-95代码:MS-012AAJESD-30 代码:R-PDSO-G8
JESD-609代码:e3湿度敏感等级:1
元件数量:1端子数量:8
工作模式:ENHANCEMENT MODE封装主体材料:PLASTIC/EPOXY
封装形状:RECTANGULAR封装形式:SMALL OUTLINE
峰值回流温度(摄氏度):NOT SPECIFIED极性/信道类型:P-CHANNEL
最大脉冲漏极电流 (IDM):45 A表面贴装:YES
端子面层:Matte Tin (Sn)端子形式:GULL WING
端子位置:DUAL处于峰值回流温度下的最长时间:NOT SPECIFIED
晶体管应用:SWITCHING晶体管元件材料:SILICON
Base Number Matches:1

IRF7416TRPBF 数据手册

 浏览型号IRF7416TRPBF的Datasheet PDF文件第2页浏览型号IRF7416TRPBF的Datasheet PDF文件第3页浏览型号IRF7416TRPBF的Datasheet PDF文件第4页浏览型号IRF7416TRPBF的Datasheet PDF文件第5页浏览型号IRF7416TRPBF的Datasheet PDF文件第6页浏览型号IRF7416TRPBF的Datasheet PDF文件第7页 
PD - 95137A  
IRF7416PbF  
HEXFET® Power MOSFET  
l Generation V Technology  
l Ultra Low On-Resistance  
l P-Channel Mosfet  
l Surface Mount  
l Available in Tape & Reel  
l Dynamic dv/dt Rating  
l Fast Switching  
A
D
1
2
3
4
8
S
S
VDSS = -30V  
7
D
6
5
S
G
D
D
RDS(on) = 0.02Ω  
l Lead-Free  
Top View  
Description  
Fifth Generation HEXFETs from International Rectifier  
utilize advanced processing techniques to achieve  
extremely low on-resistance per silicon area. This benefit,  
combined with the fast switching speed and ruggedized  
device design that HEXFET Power MOSFETs are well  
knownfor, providesthedesignerwithanextremelyefficient  
and reliable device for use in a wide variety of applications.  
The SO-8 has been modified through a customized  
leadframe for enhanced thermal characteristics and  
multiple-die capability making it ideal in a variety of power  
applications. With these improvements, multiple devices  
can be used in an application with dramatically reduced  
board space. The package is designed for vapor phase,  
infra red, or wave soldering techniques. Power dissipation  
of greater than 0.8W is possible in a typical PCB mount  
application.  
SO-8  
Absolute Maximum Ratings  
Parameter  
Max.  
-10  
Units  
Continuous Drain Current, VGS @ -10V  
Continuous Drain Current, VGS @ -10V  
Pulsed Drain Current  
I
I
I
@ TA = 25°C  
D
D
A
-7.1  
-45  
@ TA = 70°C  
DM  
W
W/°C  
V
Power Dissipation  
2.5  
P
@TA = 25°C  
D
Linear Derating Factor  
Gate-to-Source Voltage  
0.02  
± 20  
V
GS  
EAS  
Single Pulse Avalanche Energy  
Peak Diode Recovery dv/dt  
Operating Junction and  
370  
-5.0  
mJ  
dv/dt  
V/ns  
T
T
J
-55 to + 150  
°C  
Storage Temperature Range  
STG  
Thermal Resistance  
Parameter  
Max.  
Units  
RθJA  
Junction-to-Ambient  
50  
°C/W  
www.irf.com  
1
06/29/11  

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