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FDMC2674_12 PDF预览

FDMC2674_12

更新时间: 2024-10-28 12:23:35
品牌 Logo 应用领域
飞兆/仙童 - FAIRCHILD /
页数 文件大小 规格书
7页 318K
描述
N-Channel UltraFET Trench MOSFET 220V, 7.0A, 366mΩ

FDMC2674_12 数据手册

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November 2012  
FDMC2674  
tm  
N-Channel UltraFET Trench MOSFET  
220V, 7.0A, 366mΩ  
Features  
General Description  
„ Max rDS(on) = 366mΩ at VGS = 10V, ID = 1.0A  
„ Typ Qg = 12.7nC at VGS = 10V  
„ Low Miller charge  
UltraFET device combines characteristics that enable  
benchmark efficiency in power conversion applications.  
Optimized for rDS(on), low ESR, low total and Miller gate charge,  
these devices are ideal for high frequency DC to DC converters.  
„ Low Qrr Body Diode  
Application  
„ Optimized efficiency at high frequencies  
„ UIS Capability ( Single Pulse and Repetitive Pulse)  
„ RoHS Compliant  
„ DC/DC converters and Off-Line UPS  
„ Distributed Power Architectures  
Bottom  
D D  
Top  
7
D
D
8
2
6
5
4
3
2
1
G
S
S
S
D
D
D
5
6
7
8
D
G S  
S
S
1
3
4
MLP 3.3x3.3  
MOSFET Maximum Ratings TA = 25°C unless otherwise noted  
Symbol  
VDS  
VGS  
Parameter  
Ratings  
220  
Units  
Drain to Source Voltage  
Gate to Source Voltage  
V
V
±20  
Drain Current -Continuous (Silicon limited)  
-Continuous  
TC= 25°C  
TA = 25°C  
7.0  
ID  
(Note 1b)  
(Note 3)  
1.0  
A
-Pulsed  
13.8  
11  
EAS  
Single Pulse Avalanche Energy  
Power Dissipation  
mJ  
W
TC = 25°C  
TA = 25°C  
42  
PD  
Power Dissipation  
(Note 1a)  
2.1  
TJ, TSTG  
Operating and Storage Junction Temperature Range  
-55 to +150  
°C  
Thermal Characteristics  
RθJC  
RθJA  
Thermal Resistance, Junction to Case  
Thermal Resistance, Junction to Ambient  
(Note 1)  
3.0  
60  
°C/W  
(Note 1a)  
Package Marking and Ordering Information  
Device Marking  
Device  
Package  
Reel Size  
13 ’’  
Tape Width  
12 mm  
Quantity  
FDMC2674  
FDMC2674  
MLP 3.3X3.3  
3000 units  
1
©2012 Fairchild Semiconductor Corporation  
FDMC2674 Rev.F3  
www.fairchildsemi.com  

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