DATA SHEET
www.onsemi.com
MOSFET – P-Channel,
POWERTRENCH)
8
S
S
S
G
7
6
5
1
D
D
2
-30 V, -18 A, 20 mW
D
3
D
4
Top
Bottom
WDFN8 3.3x3.3, 0.65P
CASE 511DR
FMDC4435BZ/FDMC4435BZ−F127
FDMC4435BZ,
FDMC4435BZ-F127,
FDMC4435BZ-F127-L701
Pin 1
G
S
S
S
General Description
D
This P−Channel MOSFET is produced using onsemi’s advanced
POWERTRENCH process that has been especially tailored to
minimize the on−state resistance. This device is well suited for Power
Management and load switching applications common in Notebook
Computers and Portable Battery Packs.
D
D
D
Bottom
Top
WDFN8 3.3x3.3, 0.65P
CASE 511DQ
(Option A)
FDMC4435BZ−F127−L701
Features
Max r
Max r
= 20 mW at V = −10 V, I = −8.5 A
GS D
DS(on)
DS(on)
MARKING DIAGRAM
= 37 mW at V = −4.5 V, I = −6.3 A
GS
D
Extended V
Range (−25 V) for Battery Applications
GSS
FDMC
4435BZ
ALYW
ON AXYKK
FDMC
High Performance Trench Technology for Extremely Low r
High Power and Current Handling Capability
HBM ESD Protection Level > 7 kV Typical*
100% UIL Tested
DS(on)
4435BZ
FDMC4435BZ/
FDMC4435BZ−F127
FDMC4435BZ−F127−L701
These Devices are Pb−Free and are RoHS Compliant
FDMC4435BZ = Specific Device Code
A
= Assembly Location
XY
KK
L
= 2−Digit Date Code
= 2−Digit Lot Run Traceability Code
= Wafer Lot Number
Applications
High Side in DC − DC Buck Converters
Notebook Battery Power Management
Load Switch in Notebook
YW
= Assembly Start Week
PIN ASSIGNMENT
D
D
D
5
6
7
G
S
S
S
4
3
2
D
8
1
ORDERING INFORMATION
See detailed ordering and shipping information on page 6 of
this data sheet.
*The diode connected between the gate and source servers only as protection
against ESD. No gate overvoltage rating is implied.
Semiconductor Components Industries, LLC, 2010
1
Publication Order Number:
February, 2023 − Rev. 5
FDMC4435BZ/D