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FDMC4435BZ PDF预览

FDMC4435BZ

更新时间: 2024-11-17 03:36:27
品牌 Logo 应用领域
飞兆/仙童 - FAIRCHILD /
页数 文件大小 规格书
7页 388K
描述
P-Channel Power Trench㈢ MOSFET -30V, -18A, 20.0mヘ

FDMC4435BZ 技术参数

是否无铅: 不含铅是否Rohs认证: 符合
生命周期:Transferred零件包装代码:MLP
包装说明:SMALL OUTLINE, S-PDSO-N5针数:8
Reach Compliance Code:compliantECCN代码:EAR99
HTS代码:8541.29.00.95风险等级:3.86
其他特性:ULTRA-LOW RESISTANCE雪崩能效等级(Eas):24 mJ
外壳连接:DRAIN配置:SINGLE WITH BUILT-IN DIODE
最小漏源击穿电压:30 V最大漏极电流 (Abs) (ID):31 A
最大漏极电流 (ID):8.5 A最大漏源导通电阻:0.02 Ω
FET 技术:METAL-OXIDE SEMICONDUCTORJESD-30 代码:S-PDSO-N5
JESD-609代码:e4湿度敏感等级:1
元件数量:1端子数量:5
工作模式:ENHANCEMENT MODE最高工作温度:150 °C
封装主体材料:PLASTIC/EPOXY封装形状:SQUARE
封装形式:SMALL OUTLINE峰值回流温度(摄氏度):260
极性/信道类型:P-CHANNEL最大功率耗散 (Abs):31 W
最大脉冲漏极电流 (IDM):50 A认证状态:Not Qualified
子类别:Other Transistors表面贴装:YES
端子面层:Nickel/Palladium/Gold (Ni/Pd/Au)端子形式:NO LEAD
端子位置:DUAL处于峰值回流温度下的最长时间:NOT SPECIFIED
晶体管应用:SWITCHING晶体管元件材料:SILICON
Base Number Matches:1

FDMC4435BZ 数据手册

 浏览型号FDMC4435BZ的Datasheet PDF文件第2页浏览型号FDMC4435BZ的Datasheet PDF文件第3页浏览型号FDMC4435BZ的Datasheet PDF文件第4页浏览型号FDMC4435BZ的Datasheet PDF文件第5页浏览型号FDMC4435BZ的Datasheet PDF文件第6页浏览型号FDMC4435BZ的Datasheet PDF文件第7页 
February 2008  
FDMC4435BZ  
tm  
P-Channel Power Trench® MOSFET  
-30V, -18A, 20.0mΩ  
Features  
General Description  
„ Max rDS(on) = 20.0mat VGS = -10V, ID = -8.5A  
„ Max rDS(on) = 37.0mat VGS = -4.5V, ID = -6.3A  
„ Extended VGSS range (-25V) for battery applications  
„ High performance trench technology for extremely low rDS(on)  
„ High power and current handling capability  
„ HBM ESD protection level >7kV typical (Note 4)  
„ 100% UIL Tested  
This P-Channel MOSFET is produced using Fairchild  
Semiconductor’s advanced Power Trench® process that has  
been especially tailored to minimize the on-state resistance. This  
devie is well suited for Power Management and load switching  
applications common in Notebook Computers and Portable  
Battery Packs.  
Applications  
„ High side in DC - DC Buck Converters  
„ Notebook battery power management  
„ Load switch in Notebook  
„ Termination is Lead-free and RoHS Compliant  
Top  
Bottom  
Pin 1  
S
G
D
5
4
S
S
G
D
D
6
7
3
2
S
S
S
D
D
D
1
8
D
D
Power 33  
MOSFET Maximum Ratings TA = 25°C unless otherwise noted  
Symbol  
VDS  
VGS  
Parameter  
Ratings  
-30  
Units  
Drain to Source Voltage  
Gate to Source Voltage  
V
V
±25  
Drain Current -Continuous (Package limited)  
-Continuous (Silicon limited)  
-Continuous  
TC = 25°C  
C = 25°C  
-18  
T
-31  
ID  
A
TA = 25°C  
(Note 1a)  
(Note 3)  
-8.5  
-Pulsed  
-50  
EAS  
Single Pulse Avalanche Energy  
Power Dissipation  
24  
mJ  
W
TC = 25°C  
TA = 25°C  
31  
PD  
Power Dissipation  
(Note 1a)  
2.3  
TJ, TSTG  
Operating and Storage Junction Temperature Range  
-55 to +150  
°C  
Thermal Characteristics  
RθJC  
RθJA  
Thermal Resistance, Junction to Case  
Thermal Resistance, Junction to Ambient  
4
°C/W  
(Note 1a)  
53  
Package Marking and Ordering Information  
Device Marking  
Device  
Package  
Reel Size  
13’’  
Tape Width  
12mm  
Quantity  
FDMC4435BZ  
FDMC4435BZ  
Power 33  
3000 units  
1
©2008 Fairchild Semiconductor Corporation  
FDMC4435BZ Rev.C  
www.fairchildsemi.com  

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