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FDMC6679AZ PDF预览

FDMC6679AZ

更新时间: 2024-11-17 06:59:07
品牌 Logo 应用领域
飞兆/仙童 - FAIRCHILD /
页数 文件大小 规格书
7页 300K
描述
P-Channel PowerTrench® MOSFET -30 V, -20 A, 10 mΩ

FDMC6679AZ 数据手册

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July 2009  
FDMC6679AZ  
P-Channel PowerTrench® MOSFET  
-30 V, -20 A, 10 mΩ  
Features  
General Description  
The FDMC6679AZ has been designed to minimize losses in  
load switch applications. Advancements in both silicon and  
package technologies have been combined to offer the lowest  
rDS(on) and ESD protection.  
„ Max rDS(on) = 10 mat VGS = -10 V, ID = -11.5 A  
„ Max rDS(on) = 18 mat VGS = -4.5 V, ID = -8.5 A  
„ HBM ESD protection level of 8 kV typical(note 3)  
„ Extended VGSS range (-25 V) for battery applications  
„ High performance trench technology for extremely low rDS(on)  
„ High power and current handling capability  
Applications  
„ Load Switch in Notebook and Server  
„ Notebook Battery Pack Power Management  
„ Termination is Lead-free and RoHS Compliant  
Bottom  
Top  
Pin 1  
D
D
D
5
6
7
G
S
S
S
4
3
2
G
S
S
S
D
D
D
D
8
1
D
MLP 3.3x3.3  
MOSFET Maximum Ratings TA = 25 °C unless otherwise noted  
Symbol  
VDS  
VGS  
Parameter  
Ratings  
-30  
Units  
Drain to Source Voltage  
Gate to Source Voltage  
V
V
±25  
Drain Current -Continuous (Package limited)  
-Continuous (Silicon limited)  
-Continuous  
TC = 25 °C  
C = 25 °C  
-20  
T
-51  
ID  
A
TA = 25 °C  
(Note 1a)  
(Note 1a)  
-11.5  
-32  
-Pulsed  
Power Dissipation  
TC = 25 °C  
TA = 25 °C  
41  
PD  
W
Power Dissipation  
2.3  
TJ, TSTG  
Operating and Storage Junction Temperature Range  
-55 to +150  
°C  
Thermal Characteristics  
RθJC  
RθJA  
Thermal Resistance, Junction to Case  
Thermal Resistance, Junction to Ambient  
3
°C/W  
(Note 1a)  
53  
Package Marking and Ordering Information  
Device Marking  
Device  
Package  
Reel Size  
13 ’’  
Tape Width  
12 mm  
Quantity  
FDMC6679AZ  
FDMC6679AZ  
MLP 3.3x3.3  
3000 units  
©2009 Fairchild Semiconductor Corporation  
FDMC6679AZ Rev.D1  
www.fairchildsemi.com  
1

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