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FDMC6675BZ PDF预览

FDMC6675BZ

更新时间: 2024-11-19 06:59:07
品牌 Logo 应用领域
飞兆/仙童 - FAIRCHILD 晶体晶体管功率场效应晶体管开关脉冲光电二极管
页数 文件大小 规格书
7页 287K
描述
P-Channel Power Trench® MOSFET -30 V, -20 A, 14.4 mΩ

FDMC6675BZ 技术参数

是否无铅: 不含铅是否Rohs认证: 符合
生命周期:Transferred零件包装代码:MLP
包装说明:SMALL OUTLINE, S-PDSO-N5针数:8
Reach Compliance Code:compliantECCN代码:EAR99
HTS代码:8541.29.00.95风险等级:5.72
Is Samacsys:N其他特性:ULTRA-LOW RESISTANCE
外壳连接:DRAIN配置:SINGLE WITH BUILT-IN DIODE
最小漏源击穿电压:30 V最大漏极电流 (Abs) (ID):40 A
最大漏极电流 (ID):9.5 A最大漏源导通电阻:0.0144 Ω
FET 技术:METAL-OXIDE SEMICONDUCTORJESD-30 代码:S-PDSO-N5
JESD-609代码:e4湿度敏感等级:1
元件数量:1端子数量:5
工作模式:ENHANCEMENT MODE最高工作温度:150 °C
封装主体材料:PLASTIC/EPOXY封装形状:SQUARE
封装形式:SMALL OUTLINE峰值回流温度(摄氏度):260
极性/信道类型:P-CHANNEL最大功率耗散 (Abs):36 W
最大脉冲漏极电流 (IDM):32 A认证状态:Not Qualified
子类别:Other Transistors表面贴装:YES
端子面层:Nickel/Palladium/Gold (Ni/Pd/Au)端子形式:NO LEAD
端子位置:DUAL处于峰值回流温度下的最长时间:NOT SPECIFIED
晶体管应用:SWITCHING晶体管元件材料:SILICON
Base Number Matches:1

FDMC6675BZ 数据手册

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June 2009  
FDMC6675BZ  
P-Channel Power Trench® MOSFET  
-30 V, -20 A, 14.4 mΩ  
Features  
General Description  
„ Max rDS(on) = 14.4 mat VGS = -10 V, ID = -9.5 A  
„ Max rDS(on) = 27.0 mat VGS = -4.5 V, ID = -6.9 A  
„ HBM ESD protection level of 8 kV typical(note 3)  
„ Extended VGSS range (-25 V) for battery applications  
„ High performance trench technology for extremely low rDS(on)  
„ High power and current handling capability  
„ Termination is Lead-free and RoHS Compliant  
The FDMC6675BZ has been designed to minimize losses in  
load switch applications. Advancements in both silicon and  
package technologies have been combined to offer the lowest  
rDS(on) and ESD protection.  
Application  
„ Load Switch in Notebook and Server  
„ Notebook Battery Pack Power Management  
Bottom  
Top  
Pin 1  
D
D
D
5
6
7
G
S
S
S
4
3
2
G
S
S
S
D
D
D
D
8
1
D
MLP 3.3x3.3  
MOSFET Maximum Ratings TA = 25 °C unless otherwise noted  
Symbol  
VDS  
VGS  
Parameter  
Ratings  
-30  
Units  
Drain to Source Voltage  
Gate to Source Voltage  
V
V
±25  
Drain Current -Continuous (Package limited)  
-Continuous (Silicon limited)  
-Continuous  
TC = 25 °C  
C = 25 °C  
-20  
T
-40  
ID  
A
TA = 25 °C  
(Note 1a)  
(Note 1a)  
-9.5  
-Pulsed  
-32  
Power Dissipation  
TC = 25 °C  
TA = 25 °C  
36  
PD  
W
Power Dissipation  
2.3  
TJ, TSTG  
Operating and Storage Junction Temperature Range  
-55 to +150  
°C  
Thermal Characteristics  
RθJC  
RθJA  
Thermal Resistance, Junction to Case  
Thermal Resistance, Junction to Ambient  
3.4  
53  
°C/W  
(Note 1a)  
Package Marking and Ordering Information  
Device Marking  
Device  
Package  
Reel Size  
13 ’’  
Tape Width  
12 mm  
Quantity  
FDMC6675BZ  
FDMC6675BZ  
MLP 3.3X3.3  
3000 units  
©2009 Fairchild Semiconductor Corporation  
FDMC6675BZ Rev.D1  
www.fairchildsemi.com  
1

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