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NTMFS6H801NLT1G

更新时间: 2024-09-16 11:14:59
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安森美 - ONSEMI /
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7页 218K
描述
MOSFET - Power, Single N-Channel, 80 V, 2.7 mΩ, 160 A - NTMFS6H801NL

NTMFS6H801NLT1G 数据手册

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MOSFET - Power, Single  
N-Channel  
80 V, 2.7 mW, 160 A  
NTMFS6H801NL  
Features  
www.onsemi.com  
Small Footprint (5x6 mm) for Compact Design  
Low R  
to Minimize Conduction Losses  
DS(on)  
Low Q and Capacitance to Minimize Driver Losses  
G
These Devices are PbFree and are RoHS Compliant  
V
R
MAX  
I MAX  
D
(BR)DSS  
DS(ON)  
2.7 mW @ 10 V  
3.3 mW @ 4.5 V  
MAXIMUM RATINGS (T = 25°C unless otherwise noted)  
J
80 V  
160 A  
Parameter  
DraintoSource Voltage  
Symbol  
Value  
80  
Unit  
V
V
DSS  
GatetoSource Voltage  
V
GS  
20  
V
D (5,6)  
Continuous Drain  
Current R  
T
= 25°C  
= 100°C  
= 25°C  
I
160  
113  
167  
83  
A
C
D
q
JC  
T
C
(Notes 1, 3)  
Steady  
State  
Power Dissipation  
T
C
P
W
A
D
G (4)  
R
(Note 1)  
q
JC  
T
C
= 100°C  
Continuous Drain  
Current R  
T = 25°C  
A
I
D
24  
S (1,2,3)  
NCHANNEL MOSFET  
q
JA  
T = 100°C  
A
17  
(Notes 1, 2, 3)  
Steady  
State  
Power Dissipation  
T = 25°C  
A
P
3.8  
1.9  
900  
W
D
R
(Notes 1, 2)  
q
JA  
T = 100°C  
A
MARKING  
DIAGRAM  
Pulsed Drain Current  
T = 25°C, t = 10 ms  
I
DM  
A
A
p
D
Operating Junction and Storage Temperature  
Range  
T , T  
55 to  
°C  
J
stg  
1
+175  
S
S
S
G
D
D
DFN5  
(SO8FL)  
CASE 488AA  
STYLE 1  
6H801L  
AYWZZ  
Source Current (Body Diode)  
I
S
139  
706  
A
Single Pulse DraintoSource Avalanche  
E
AS  
mJ  
Energy (I  
= 12.2 A)  
L(pk)  
D
Lead Temperature for Soldering Purposes  
(1/8from case for 10 s)  
T
L
260  
°C  
A
Y
= Assembly Location  
= Year  
W
ZZ  
= Work Week  
= Lot Traceability  
Stresses exceeding those listed in the Maximum Ratings table may damage the  
device. If any of these limits are exceeded, device functionality should not be  
assumed, damage may occur and reliability may be affected.  
THERMAL RESISTANCE MAXIMUM RATINGS  
ORDERING INFORMATION  
See detailed ordering, marking and shipping information in the  
package dimensions section on page 5 of this data sheet.  
Parameter  
Symbol  
Value  
0.9  
Unit  
JunctiontoCase Steady State  
JunctiontoAmbient Steady State (Note 2)  
R
°C/W  
q
JC  
R
39  
q
JA  
1. The entire application environment impacts the thermal resistance values shown,  
they are not constants and are only valid for the particular conditions noted.  
2
2. Surfacemounted on FR4 board using a 650 mm , 2 oz. Cu pad.  
3. Maximum current for pulses as long as 1 second is higher but is dependent  
on pulse duration and duty cycle.  
© Semiconductor Components Industries, LLC, 2019  
1
Publication Order Number:  
March, 2020 Rev. 0  
NTMFS6H801NL/D  
 

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