DATA SHEET
www.onsemi.com
MOSFET - Power, Single
N-Channel, Source-Down
TDFN9
V
R
MAX
I MAX
D
(BR)DSS
DS(ON)
1.5 mW @ 10 V
2.3 mW @ 4.5 V
60 V
235 A
60 V, 1.5 mW, 235 A
D (5, 6, 7, 8)
NTMFSS1D5N06CL
Features
G (9)
• Small Footprint (5x6 mm) for Compact Design
• Low R
to Minimize Conduction Losses
DS(on)
S (1, 2, 3, 4)
N−CHANNEL MOSFET
• Low Q and Capacitance to Minimize Driver Losses
G
• These Devices are Pb−Free, Halogen−Free / BFR Free and are RoHS
Compliant
Typical Applications
MARKING
DIAGRAM
• DC−DC Converters
• Power Load Switch
• Notebook Battery Management
1D5N06
AYWZZ
TDFN9 5x6
CASE 520AE
MAXIMUM RATINGS (T = 25°C unless otherwise noted)
J
Parameter
Drain−to−Source Voltage
Symbol
Value
60
Unit
V
1D5N06 = Specific Device Code
V
DSS
A
Y
= Assembly Location
= Year
Gate−to−Source Voltage
V
GS
20
V
W
ZZ
= Work Week
= Wafer Lot
Continuous Drain
Current R
T
= 25°C
= 100°C
= 25°C
I
D
237
149
144
57
A
C
Steady
State
q
JC
T
C
Power Dissipation
R
T
C
P
D
W
A
Steady
State
ORDERING INFORMATION
q
JC
T
C
= 100°C
†
Device
NTMFSS1D5N06CL
Package
Shipping
Continuous Drain Cur-
T = 25°C
A
I
D
31
Steady
State
TDFN9
(Pb−Free)
3000 / Tape &
Reel
rent R
(Notes 1, 2)
q
JA
T = 100°C
A
19
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
Power Dissipation
(Notes 1, 2)
T = 25°C
P
2.5
1
W
A
D
Steady
State
R
q
JA
T = 100°C
A
Pulsed Drain Current
T = 25°C, t = 10 ms
I
DM
1698
A
A
p
Operating Junction and Storage Temperature
Range
T , T
−55 to
+150
°C
J
stg
Single Pulse Drain−to−Source Avalanche
E
AS
207
mJ
Energy (I
= 75 A)
L(pk)
Lead Temperature Soldering Reflow for Solder-
ing Purposes (1/8″ from case for 10 s)
T
L
260
°C
Stresses exceeding those listed in the Maximum Ratings table may damage the
device. If any of these limits are exceeded, device functionality should not be
assumed, damage may occur and reliability may be affected.
THERMAL RESISTANCE MAXIMUM RATINGS
Parameter
Symbol
Value
0.86
50
Unit
Junction−to−Case − Steady State
Junction−to−Ambient − Steady State (Note 2)
R
°C/W
q
JC
R
q
JA
1. The entire application environment impacts the thermal resistance values shown,
they are not constants and are only valid for the particular conditions noted.
2
2. Surface−mounted on FR4 board using a 1 in pad size, 2 oz. Cu pad.
© Semiconductor Components Industries, LLC, 2018
1
Publication Order Number:
January, 2023 − Rev. 3
NTMFSS1D5N06CL/D