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NTMFSS1D5N06CL PDF预览

NTMFSS1D5N06CL

更新时间: 2024-11-10 11:15:27
品牌 Logo 应用领域
安森美 - ONSEMI /
页数 文件大小 规格书
7页 365K
描述
MOSFET, Power, Single, N-Channel, Source-Down, TDFN9,  60V, 1.5mΩ, 235A

NTMFSS1D5N06CL 数据手册

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DATA SHEET  
www.onsemi.com  
MOSFET - Power, Single  
N-Channel, Source-Down  
TDFN9  
V
R
MAX  
I MAX  
D
(BR)DSS  
DS(ON)  
1.5 mW @ 10 V  
2.3 mW @ 4.5 V  
60 V  
235 A  
60 V, 1.5 mW, 235 A  
D (5, 6, 7, 8)  
NTMFSS1D5N06CL  
Features  
G (9)  
Small Footprint (5x6 mm) for Compact Design  
Low R  
to Minimize Conduction Losses  
DS(on)  
S (1, 2, 3, 4)  
NCHANNEL MOSFET  
Low Q and Capacitance to Minimize Driver Losses  
G
These Devices are PbFree, HalogenFree / BFR Free and are RoHS  
Compliant  
Typical Applications  
MARKING  
DIAGRAM  
DCDC Converters  
Power Load Switch  
Notebook Battery Management  
1D5N06  
AYWZZ  
TDFN9 5x6  
CASE 520AE  
MAXIMUM RATINGS (T = 25°C unless otherwise noted)  
J
Parameter  
DraintoSource Voltage  
Symbol  
Value  
60  
Unit  
V
1D5N06 = Specific Device Code  
V
DSS  
A
Y
= Assembly Location  
= Year  
GatetoSource Voltage  
V
GS  
20  
V
W
ZZ  
= Work Week  
= Wafer Lot  
Continuous Drain  
Current R  
T
= 25°C  
= 100°C  
= 25°C  
I
D
237  
149  
144  
57  
A
C
Steady  
State  
q
JC  
T
C
Power Dissipation  
R
T
C
P
D
W
A
Steady  
State  
ORDERING INFORMATION  
q
JC  
T
C
= 100°C  
Device  
NTMFSS1D5N06CL  
Package  
Shipping  
Continuous Drain Cur-  
T = 25°C  
A
I
D
31  
Steady  
State  
TDFN9  
(PbFree)  
3000 / Tape &  
Reel  
rent R  
(Notes 1, 2)  
q
JA  
T = 100°C  
A
19  
†For information on tape and reel specifications,  
including part orientation and tape sizes, please  
refer to our Tape and Reel Packaging Specification  
Brochure, BRD8011/D.  
Power Dissipation  
(Notes 1, 2)  
T = 25°C  
P
2.5  
1
W
A
D
Steady  
State  
R
q
JA  
T = 100°C  
A
Pulsed Drain Current  
T = 25°C, t = 10 ms  
I
DM  
1698  
A
A
p
Operating Junction and Storage Temperature  
Range  
T , T  
55 to  
+150  
°C  
J
stg  
Single Pulse DraintoSource Avalanche  
E
AS  
207  
mJ  
Energy (I  
= 75 A)  
L(pk)  
Lead Temperature Soldering Reflow for Solder-  
ing Purposes (1/8from case for 10 s)  
T
L
260  
°C  
Stresses exceeding those listed in the Maximum Ratings table may damage the  
device. If any of these limits are exceeded, device functionality should not be  
assumed, damage may occur and reliability may be affected.  
THERMAL RESISTANCE MAXIMUM RATINGS  
Parameter  
Symbol  
Value  
0.86  
50  
Unit  
JunctiontoCase Steady State  
JunctiontoAmbient Steady State (Note 2)  
R
°C/W  
q
JC  
R
q
JA  
1. The entire application environment impacts the thermal resistance values shown,  
they are not constants and are only valid for the particular conditions noted.  
2
2. Surfacemounted on FR4 board using a 1 in pad size, 2 oz. Cu pad.  
© Semiconductor Components Industries, LLC, 2018  
1
Publication Order Number:  
January, 2023 Rev. 3  
NTMFSS1D5N06CL/D  
 

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