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NTMJS0D8N04CLTWG

更新时间: 2024-11-10 11:14:55
品牌 Logo 应用领域
安森美 - ONSEMI /
页数 文件大小 规格书
7页 369K
描述
Power MOSFET 40 V, 0.83Ω, 336 A, Single N-Channel

NTMJS0D8N04CLTWG 数据手册

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MOSFET – Power, Single  
N-Channel  
40 V, 0.72 mW, 368 A  
NTMJS0D8N04CL  
Features  
www.onsemi.com  
Small Footprint (5x6 mm) for Compact Design  
Low R  
to Minimize Conduction Losses  
DS(on)  
Low Q and Capacitance to Minimize Driver Losses  
G
V
R
MAX  
I MAX  
D
(BR)DSS  
DS(ON)  
LFPAK8 Package, Industry Standard  
0.72 mW @ 10 V  
1.15 mW @ 4.5 V  
These Devices are PbFree and are RoHS Compliant  
40 V  
368 A  
MAXIMUM RATINGS (T = 25°C unless otherwise noted)  
J
Parameter  
DraintoSource Voltage  
Symbol  
Value  
40  
Unit  
V
V
DSS  
D (58)  
GatetoSource Voltage  
V
GS  
20  
V
Continuous Drain  
Current R  
Steady  
State  
T
= 25°C  
= 100°C  
= 25°C  
I
368  
260  
180  
90  
A
C
D
q
JC  
T
C
(Notes 1, 3)  
G (4)  
Power Dissipation  
T
C
P
W
A
D
R
(Note 1)  
q
JC  
T
C
= 100°C  
S (1,2,3)  
NCHANNEL MOSFET  
Continuous Drain  
Current R  
Steady  
State  
T = 25°C  
A
I
D
56  
q
JA  
T = 100°C  
A
40  
(Notes 1, 2, 3)  
Power Dissipation  
T = 25°C  
P
4.2  
2.1  
900  
W
A
D
MARKING  
DIAGRAM  
R
(Notes 1, 2)  
q
JA  
T = 100°C  
A
D
D
D
D
Pulsed Drain Current  
T = 25°C, t = 10 ms  
I
DM  
A
A
p
Operating Junction and Storage Temperature  
Range  
T , T  
55 to  
+175  
°C  
J
stg  
0D8N04  
CL  
LFPAK8  
CASE 760AA  
ALLYW  
Source Current (Body Diode)  
I
150  
A
S
Single Pulse DraintoSource Avalanche  
E
AS  
1286  
mJ  
1
Energy (I  
= 32.8 A)  
L(pk)  
S
S
S G  
Lead Temperature for Soldering Purposes  
(1/8from case for 10 s)  
T
260  
°C  
L
0D8N04CL = Specific Device Code  
A
LL  
Y
= Assembly Location  
= Wafer Lot  
= Year  
Stresses exceeding those listed in the Maximum Ratings table may damage the  
device. If any of these limits are exceeded, device functionality should not be  
assumed, damage may occur and reliability may be affected.  
W
= Work Week  
THERMAL RESISTANCE MAXIMUM RATINGS  
Parameter  
Symbol  
Value  
0.83  
Unit  
ORDERING INFORMATION  
See detailed ordering, marking and shipping information on  
page 5 of this data sheet.  
JunctiontoCase Steady State  
JunctiontoAmbient Steady State (Note 2)  
R
°C/W  
q
JC  
R
35.9  
q
JA  
1. The entire application environment impacts the thermal resistance values shown,  
they are not constants and are only valid for the particular conditions noted.  
2
2. Surfacemounted on FR4 board using a 650 mm , 2 oz. Cu pad.  
3. Maximum current for pulses as long as 1 second is higher but is dependent  
on pulse duration and duty cycle.  
© Semiconductor Components Industries, LLC, 2019  
1
Publication Order Number:  
November, 2019 Rev. 0  
NTMJS0D8N04CL/D  
 

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