MOSFET – Power, Single
N-Channel
40 V, 0.72 mW, 368 A
NTMJS0D8N04CL
Features
www.onsemi.com
• Small Footprint (5x6 mm) for Compact Design
• Low R
to Minimize Conduction Losses
DS(on)
• Low Q and Capacitance to Minimize Driver Losses
G
V
R
MAX
I MAX
D
(BR)DSS
DS(ON)
• LFPAK8 Package, Industry Standard
0.72 mW @ 10 V
1.15 mW @ 4.5 V
• These Devices are Pb−Free and are RoHS Compliant
40 V
368 A
MAXIMUM RATINGS (T = 25°C unless otherwise noted)
J
Parameter
Drain−to−Source Voltage
Symbol
Value
40
Unit
V
V
DSS
D (5−8)
Gate−to−Source Voltage
V
GS
20
V
Continuous Drain
Current R
Steady
State
T
= 25°C
= 100°C
= 25°C
I
368
260
180
90
A
C
D
q
JC
T
C
(Notes 1, 3)
G (4)
Power Dissipation
T
C
P
W
A
D
R
(Note 1)
q
JC
T
C
= 100°C
S (1,2,3)
N−CHANNEL MOSFET
Continuous Drain
Current R
Steady
State
T = 25°C
A
I
D
56
q
JA
T = 100°C
A
40
(Notes 1, 2, 3)
Power Dissipation
T = 25°C
P
4.2
2.1
900
W
A
D
MARKING
DIAGRAM
R
(Notes 1, 2)
q
JA
T = 100°C
A
D
D
D
D
Pulsed Drain Current
T = 25°C, t = 10 ms
I
DM
A
A
p
Operating Junction and Storage Temperature
Range
T , T
−55 to
+175
°C
J
stg
0D8N04
CL
LFPAK8
CASE 760AA
ALLYW
Source Current (Body Diode)
I
150
A
S
Single Pulse Drain−to−Source Avalanche
E
AS
1286
mJ
1
Energy (I
= 32.8 A)
L(pk)
S
S
S G
Lead Temperature for Soldering Purposes
(1/8″ from case for 10 s)
T
260
°C
L
0D8N04CL = Specific Device Code
A
LL
Y
= Assembly Location
= Wafer Lot
= Year
Stresses exceeding those listed in the Maximum Ratings table may damage the
device. If any of these limits are exceeded, device functionality should not be
assumed, damage may occur and reliability may be affected.
W
= Work Week
THERMAL RESISTANCE MAXIMUM RATINGS
Parameter
Symbol
Value
0.83
Unit
ORDERING INFORMATION
See detailed ordering, marking and shipping information on
page 5 of this data sheet.
Junction−to−Case − Steady State
Junction−to−Ambient − Steady State (Note 2)
R
°C/W
q
JC
R
35.9
q
JA
1. The entire application environment impacts the thermal resistance values shown,
they are not constants and are only valid for the particular conditions noted.
2
2. Surface−mounted on FR4 board using a 650 mm , 2 oz. Cu pad.
3. Maximum current for pulses as long as 1 second is higher but is dependent
on pulse duration and duty cycle.
© Semiconductor Components Industries, LLC, 2019
1
Publication Order Number:
November, 2019 − Rev. 0
NTMJS0D8N04CL/D