NTMJS1D0N04C
MOSFET – Power, Single,
N-Channel
40 V, 0.92 mW, 300 A
Features
www.onsemi.com
• Small Footprint (5x6 mm) for Compact Design
• Low R
to Minimize Conduction Losses
DS(on)
• Low Q and Capacitance to Minimize Driver Losses
G
• LFPAK−E Package, Industry Standard
V
R
MAX
I MAX
D
(BR)DSS
DS(ON)
• These Devices are Pb−Free and are RoHS Compliant
40 V
0.92 mW @ 10 V
300 A
MAXIMUM RATINGS (T = 25°C unless otherwise noted)
J
Parameter
Drain−to−Source Voltage
Symbol
Value
40
Unit
V
D (5−8)
V
DSS
Gate−to−Source Voltage
V
GS
20
V
Continuous Drain
Current R
T
= 25°C
= 100°C
= 25°C
I
300
212
166
83
A
C
D
q
JC
G (4)
T
C
(Notes 1, 3)
Steady
State
Power Dissipation
T
C
P
W
A
D
R
(Note 1)
S (1,2,3)
N−CHANNEL MOSFET
q
JC
T
C
= 100°C
Continuous Drain
Current R
T = 25°C
A
I
D
46
q
JA
T = 100°C
A
32
(Notes 1, 2, 3)
Steady
State
MARKING
DIAGRAM
Power Dissipation
T = 25°C
A
P
3.9
1.9
900
W
D
R
(Notes 1, 2)
q
JA
T = 100°C
A
D
D
D
D
Pulsed Drain Current
T = 25°C, t = 10 ms
I
DM
A
A
p
1D0N04
C
AWLYW
Operating Junction and Storage Temperature
Range
T , T
−55 to
°C
J
stg
+ 175
LFPAK8
CASE 760AA
Source Current (Body Diode)
I
S
158
578
A
Single Pulse Drain−to−Source Avalanche
E
AS
mJ
1
Energy (I
= 34 A)
L(pk)
S
S
S
G
Lead Temperature for Soldering Purposes
T
260
°C
L
1D0N04C = Specific Device Code
(1/8″ from case for 10 s)
A
WL
Y
= Assembly Location
= Wafer Lot
= Year
Stresses exceeding those listed in the Maximum Ratings table may damage the
device. If any of these limits are exceeded, device functionality should not be
assumed, damage may occur and reliability may be affected.
W
= Work Week
THERMAL RESISTANCE MAXIMUM RATINGS
Parameter
Symbol
Value
0.9
Unit
ORDERING INFORMATION
See detailed ordering, marking and shipping information on
page 5 of this data sheet.
Junction−to−Case − Steady State
Junction−to−Ambient − Steady State (Note 2)
R
°C/W
q
JC
R
36
q
JA
1. The entire application environment impacts the thermal resistance values shown,
they are not constants and are only valid for the particular conditions noted.
2
2. Surface−mounted on FR4 board using a 650 mm , 2 oz. Cu pad.
3. Maximum current for pulses as long as 1 second is higher but is dependent
on pulse duration and duty cycle.
© Semiconductor Components Industries, LLC, 2018
1
Publication Order Number:
June, 2019 − Rev. 0
NTMJS1D0N04C/D