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NTMJS1D0N04CTWG PDF预览

NTMJS1D0N04CTWG

更新时间: 2024-11-07 11:11:59
品牌 Logo 应用领域
安森美 - ONSEMI /
页数 文件大小 规格书
7页 357K
描述
功率 MOSFET,40 V,0.92Ω,300 A,单 N 沟道

NTMJS1D0N04CTWG 数据手册

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NTMJS1D0N04C  
MOSFET – Power, Single,  
N-Channel  
40 V, 0.92 mW, 300 A  
Features  
www.onsemi.com  
Small Footprint (5x6 mm) for Compact Design  
Low R  
to Minimize Conduction Losses  
DS(on)  
Low Q and Capacitance to Minimize Driver Losses  
G
LFPAKE Package, Industry Standard  
V
R
MAX  
I MAX  
D
(BR)DSS  
DS(ON)  
These Devices are PbFree and are RoHS Compliant  
40 V  
0.92 mW @ 10 V  
300 A  
MAXIMUM RATINGS (T = 25°C unless otherwise noted)  
J
Parameter  
DraintoSource Voltage  
Symbol  
Value  
40  
Unit  
V
D (58)  
V
DSS  
GatetoSource Voltage  
V
GS  
20  
V
Continuous Drain  
Current R  
T
= 25°C  
= 100°C  
= 25°C  
I
300  
212  
166  
83  
A
C
D
q
JC  
G (4)  
T
C
(Notes 1, 3)  
Steady  
State  
Power Dissipation  
T
C
P
W
A
D
R
(Note 1)  
S (1,2,3)  
NCHANNEL MOSFET  
q
JC  
T
C
= 100°C  
Continuous Drain  
Current R  
T = 25°C  
A
I
D
46  
q
JA  
T = 100°C  
A
32  
(Notes 1, 2, 3)  
Steady  
State  
MARKING  
DIAGRAM  
Power Dissipation  
T = 25°C  
A
P
3.9  
1.9  
900  
W
D
R
(Notes 1, 2)  
q
JA  
T = 100°C  
A
D
D
D
D
Pulsed Drain Current  
T = 25°C, t = 10 ms  
I
DM  
A
A
p
1D0N04  
C
AWLYW  
Operating Junction and Storage Temperature  
Range  
T , T  
55 to  
°C  
J
stg  
+ 175  
LFPAK8  
CASE 760AA  
Source Current (Body Diode)  
I
S
158  
578  
A
Single Pulse DraintoSource Avalanche  
E
AS  
mJ  
1
Energy (I  
= 34 A)  
L(pk)  
S
S
S
G
Lead Temperature for Soldering Purposes  
T
260  
°C  
L
1D0N04C = Specific Device Code  
(1/8from case for 10 s)  
A
WL  
Y
= Assembly Location  
= Wafer Lot  
= Year  
Stresses exceeding those listed in the Maximum Ratings table may damage the  
device. If any of these limits are exceeded, device functionality should not be  
assumed, damage may occur and reliability may be affected.  
W
= Work Week  
THERMAL RESISTANCE MAXIMUM RATINGS  
Parameter  
Symbol  
Value  
0.9  
Unit  
ORDERING INFORMATION  
See detailed ordering, marking and shipping information on  
page 5 of this data sheet.  
JunctiontoCase Steady State  
JunctiontoAmbient Steady State (Note 2)  
R
°C/W  
q
JC  
R
36  
q
JA  
1. The entire application environment impacts the thermal resistance values shown,  
they are not constants and are only valid for the particular conditions noted.  
2
2. Surfacemounted on FR4 board using a 650 mm , 2 oz. Cu pad.  
3. Maximum current for pulses as long as 1 second is higher but is dependent  
on pulse duration and duty cycle.  
© Semiconductor Components Industries, LLC, 2018  
1
Publication Order Number:  
June, 2019 Rev. 0  
NTMJS1D0N04C/D  
 

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