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NTMKB4896NT3G PDF预览

NTMKB4896NT3G

更新时间: 2024-11-06 21:04:15
品牌 Logo 应用领域
安森美 - ONSEMI 开关脉冲晶体管
页数 文件大小 规格书
5页 119K
描述
TRANSISTOR 13 A, 30 V, 0.012 ohm, N-CHANNEL, Si, POWER, MOSFET, LEAD FREE, CASE 145AC-01, ICEPAK-2, FET General Purpose Power

NTMKB4896NT3G 技术参数

是否Rohs认证: 符合生命周期:Obsolete
包装说明:LEAD FREE, CASE 145AC-01, ICEPAK-2针数:2
Reach Compliance Code:compliantECCN代码:EAR99
风险等级:5.84雪崩能效等级(Eas):149 mJ
外壳连接:DRAIN配置:SINGLE WITH BUILT-IN DIODE
最小漏源击穿电压:30 V最大漏极电流 (ID):13 A
最大漏源导通电阻:0.012 ΩFET 技术:METAL-OXIDE SEMICONDUCTOR
JESD-30 代码:R-XBCC-N2元件数量:1
端子数量:2工作模式:ENHANCEMENT MODE
最高工作温度:150 °C封装主体材料:UNSPECIFIED
封装形状:RECTANGULAR封装形式:CHIP CARRIER
峰值回流温度(摄氏度):NOT SPECIFIED极性/信道类型:N-CHANNEL
最大脉冲漏极电流 (IDM):140 A认证状态:Not Qualified
表面贴装:YES端子形式:NO LEAD
端子位置:BOTTOM处于峰值回流温度下的最长时间:NOT SPECIFIED
晶体管应用:SWITCHING晶体管元件材料:SILICON
Base Number Matches:1

NTMKB4896NT3G 数据手册

 浏览型号NTMKB4896NT3G的Datasheet PDF文件第2页浏览型号NTMKB4896NT3G的Datasheet PDF文件第3页浏览型号NTMKB4896NT3G的Datasheet PDF文件第4页浏览型号NTMKB4896NT3G的Datasheet PDF文件第5页 
NTMKB4896N  
Power MOSFET  
30 V, 70 A, Single NChannel, ICEPAK  
Features  
Low Package Inductance  
Low R  
to Minimize Conduction Losses  
DS(on)  
Low Capacitance to Minimize Driver Losses  
Optimized Gate Charge to Minimize Switching Losses  
Dual Sided Cooling Capability  
http://onsemi.com  
V
R
MAX  
I MAX  
D
(BR)DSS  
DS(ON)  
Compatible with SQ Footprint and Outline  
These are PbFree Devices  
8.0 mW @ 10 V  
30 V  
70 A  
12.0 mW @ 4.5 V  
Applications  
CPU Power Delivery  
MARKING  
DIAGRAM  
DCDC Converters  
Optimized for both Synch FET and some Control FET  
MAXIMUM RATINGS (T = 25°C unless otherwise stated)  
J
ICEPAK  
B PAD  
CASE 145AC  
B4896  
AYWWG  
G
Parameter  
DraintoSource Voltage  
Symbol Value Unit  
V
30  
20  
V
V
A
DSS  
GatetoSource Voltage  
V
GS  
Continuous Drain  
I
D
T = 25°C  
13.0  
10.4  
2.2  
A
B4896= Specific Device Code  
Current R  
(Note 1)  
q
JA  
T = 70°C  
A
A
Y
= Assembly Location  
= Year  
Power Dissipation R  
(Note 1)  
T = 25°C  
A
P
W
A
q
D
JA  
WW = Work Week  
G
= PbFree Package  
(Note: Microdot may be in either location)  
Continuous Drain  
Current R  
I
D
T = 25°C  
A
70  
40  
65  
q
JPCB  
T = 70°C  
A
Steady  
State  
(Note 2)  
Power Dissipation  
T = 25°C  
A
P
I
W
A
D
D
R
(Note 2)  
q
JPCB  
Continuous Drain  
Current R (Note 1)  
T
C
T
C
T
C
= 25°C  
= 70°C  
= 25°C  
57  
46  
42  
D
q
JC  
Power Dissipation  
(Note 1)  
P
D
W
G
R
q
JC  
Pulsed Drain Current  
T = 25°C, t = 10 ms  
I
DM  
140  
50  
A
A
A
p
S
Current Limited by Package  
T = 25°C  
A
I
Dmax  
Operating Junction and Storage Temperature  
T ,  
stg  
55 to  
150  
°C  
NCHANNEL MOSFET  
J
T
Source Current (Body Diode) (Note 1)  
Drain to Source DV/DT  
I
51  
6.0  
149  
A
S
ORDERING INFORMATION  
dV/dt  
V/ns  
mJ  
Device  
Package  
Shipping  
Single Pulse DraintoSource Avalanche Energy  
E
AS  
(T = 25°C, V = 30 V, V = 10 V,  
J
DD  
GS  
NTMKB4896NT1G ICEPAK 1500/Tape & Reel  
I = 31.5 A , L = 0.3 mH, R = 25 W)  
L
pk  
G
(PbFree)  
Lead Temperature for Soldering Purposes  
T
270  
°C  
L
NTMKB4896NT3G ICEPAK 5000/Tape & Reel  
(1/8from case for 10 s)  
(PbFree)  
Stresses exceeding Maximum Ratings may damage the device. Maximum  
Ratings are stress ratings only. Functional operation above the Recommended  
Operating Conditions is not implied. Extended exposure to stresses above the  
Recommended Operating Conditions may affect device reliability.  
†For information on tape and reel specifications,  
including part orientation and tape sizes, please  
refer to our Tape and Reel Packaging Specification  
Brochure, BRD8011/D.  
1. Surface mounted on FR4 board using 1 sqin pad, 1 oz Cu.  
2. Measured with a T of approximately 90°C using 1 oz Cu board.  
J
© Semiconductor Components Industries, LLC, 2011  
1
Publication Order Number:  
January, 2011 Rev. 1  
NTMKB4896N/D  
 

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